110-87-640-41-605101

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Sockets for Integrated Circuits (ICs), transistors and other semiconductor components are electrical connections, employed to join together, test and route electrical circuits within product designs. The 110-87-640-41-605101 application field and working principle fall under the various types of sockets available.

An IC socket works by providing a reliable, pre-configured connection between an IC package and external circuits and components. This reduces fabrication time, minimizes production errors and improves the reliability and repeatability of the overall circuit connection.

The type of sockets mentioned with respect to the 110-87-640-41-605101 application field and working principle use pins located around the perimeter of an IC package, as they are known as pin grid array (PGA) sockets. These are often referred to as dual row sockets due to the two rows of pins on either side of the socket’s perimeter.

These semiconductor socket constructions feature contact fingers that are usually soldered onto the circuit board and corresponding pins on the IC package that mate with the socket when installed. Typically, a single or dual row socket is used when space is limited, such as inside tight product enclosures.

In the 110-87-640-41-605101 application, a dual row socket features two rows of 37 pins on each side, for a total of 148 pins. A dual row socket has a feedthrough interface for an IC connection, which comes in multiple pin counts, materiality types, insert thicknesses, contact configurations and lead lengths.

These particular dual row sockets are designed for use in board-to-board or cable-to-board applications and provide high reliability and density solutions for a range of products, including RF, audio-visual equipment, industrial, telecoms, medical equipment, consumer electronics and automotive systems.

The 110-87-640-41-605101 dual row socket’s contact system consists of pre-loaded contact pins in a variety of materials. This allows the socket to accommodate a variety of device sizes, shapes and lead pitches. Its contacts are recessed into the bottom of the socket for protection and seating of the device.

The design includes an insulated base to keep contact fingers tightly in place, which creates a secure connection that is mechanically and thermally resilient. To achieve a reliable fit, the 110-87-640-41-605101 socket also employs a stiffener construction that gives the socket more rigidity and stops any bending of the contact fingers when the IC is inserted.

The 110-87-640-41-605101 socket’s flexible mm-grid platform permits customer specific iC configurations and makes it easier to create an exact fit with the IC package. It also allows it to be used with multiple ICs with varying pitches.

The main purpose of the 110-87-640-41-605101 socket is to offer its users an easy and reliable way to connect ICs, transistors and other semiconductor devices. As such, it is designed to provide fast and reliable connections without having to solder or solder or provide complex development cycles.

The 110-87-640-41-605101 socket is an ideal solution for a range of applications, such as high-speed data transfer, signal integrity, critical power and ultra-high reliability products. It also offers excellent physical and electrical performance, allowing users to create a secure and reliable connections for their products. Its ability to withstand unpredictable environments and the rigours of testing and production also make the socket a superior choice for a range of applications.

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