111-43-308-41-001000 Allicdata Electronics
Allicdata Part #:

ED90113-ND

Manufacturer Part#:

111-43-308-41-001000

Price: $ 0.80
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN IC DIP SOCKET 8POS GOLD
More Detail: N/A
DataSheet: 111-43-308-41-001000 datasheet111-43-308-41-001000 Datasheet/PDF
Quantity: 13052
1 +: $ 0.72450
10 +: $ 0.63945
25 +: $ 0.60178
50 +: $ 0.57670
100 +: $ 0.55163
250 +: $ 0.50148
500 +: $ 0.45133
1000 +: $ 0.40118
2500 +: $ 0.36357
Stock 13052Can Ship Immediately
$ 0.8
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: --
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 111
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Sockets for ICs, transistors and other electronic components provide many benefits during design, manufacture and testing. They can reduce costs, simplify debugging, and enable rapid prototyping. In this article, we will look into a 111-43-308-41-001000 socket application field and working principle.

The 111-43-308-41-001000 socket type is a fast-action surface mount IC and transistor socket that can be used with products based on QFP (Quad Flat Package) devices, CSP (Chip Scale Package), and TSOP (Thin Small Outline Package) devices. The socket offers a current and thermal performance very similar to that of the device it replaces. It features a patented tip-controlled technology, called the Reflex® Actuator, which is designed to precisely locate the device in the socket even when it is moved.

This type of socket is ideal for prototyping and assembly testing of electronics devices, providing a reliable connection that can be mounted quickly. It is also suitable for automated test system applications, where the high speed and reliability of the connection must be maintained longer compared to manual probe tests.

The 111-43-308-41-001000 socket offers great electrical continuity, insulation resistance, and thermal resistance, with good dynamic and static contact forces. It is designed to accommodate components with different pitches up to 0.5mm (QFP and CSP). The socket includes a conductive polymer contact pad for static discharge protection. The body of the socket is made of anodized aluminum for superior durability and protection against environmental factors.

The workspace of the 111-43-308-41-001000 socket is designed to maximize the number of components that can be inserted without causing interference between neighboring devices. It also included a built-in guidance system that ensures precise positioning of the IC or transistor. This improved accuracy can help reduce the risk of device failure due to incorrect mating.

This type of socket also offers a range of additional features for improved reliability and safety, including plated contacts, EMI/RFI shielding, and a thermal pad to dissipate heat away from the device. Additionally, the socket can be mounted on a PCB in a matter of seconds using pins, screws, standoffs or adhesive. It is also compatible with most standard test socketing tools.

In conclusion, the 111-43-308-41-001000 socket is an ideal socketing solution for ICs, transistors and other electronic components. It offers reliable connections, a low insertion force, and high-speed switching. Additionally, the socket is designed to provide superior durability and protect against environmental factors. It also includes features such as built-in guidance systems, plated contacts, EMI/RFI shielding, and a thermal pad for improved reliability and safety.

The specific data is subject to PDF, and the above content is for reference

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