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Sockets for ICs, Transistors are designed to receive and support semiconductor integrated circuits (ICs) on a printed circuit board, automatically making electrical connections with the pins of the semiconductor IC. The socket also provides protection for the IC from the thermal and mechanical environment of the printed circuit board. Further, the socket also has a "burn-in" capability or the capability of high current or high voltage testing the IC device prior to installation on a printed circuit board. This application field and working principle is universally applicable to socket products of all shapes and sizes.Socket products must be secured to the board in some manner, while maintaining electrical contact to the IC device. Many sockets use a latching mechanism that allows for an IC device to be seated into the socket and then latched down. This usually consists of two small plastic or metal latches that are bifurcated onto each side of the socket. The latching force is derived from the under-board mounting that is a combination of the springs and contact pressure of the IC leads. Other sockets use threaded fasteners, or a "jumper socket" that allows for direct connection of solder tabs onto theprinted circuit board. When in place, the IC package is exposed to a variety of electrical forces, temperature changes, shock, vibration, and other environmental factors. The socket product must be designed to absorb these forces and protect the IC device from any undue strain or movement. To accomplish this, socket designs usually consist of some combination of mechanical fasteners and springs. The socket package itself will also be constructed of various insulators, such as glass-filled nylon or thermoplastic. Another feature of the socket product is the lead-frame, which is a spring-like structure that fits into the leads of the IC device and allows for automatic electrical connection. Lead-frames can be soldered directly to the board, or they may be used for soldering the leads of the IC onto the board. Lead-frames improve the electrical performance of the socket product by providing a uniform electrical contact and reducing stress on the IC package. Once the socket product is mounted onto the board, integrated circuit devices can be placed in the socket and connected to the electrical connections on the printed circuit board. The socket provides an environment for electrical testing and debugging of the IC device, as well as protecting the device from environmental hazards. Typically, the IC device can be electrically tested before it is installed to ensure proper performance. Sockets are available for a variety of IC packages, from DIPs to QFPs. Each socket product is designed specifically for the IC package in question, so compatibility is important. For instance, a DIP socket may be purchased in a variety of widths, depending upon the size of the IC device. Further, the socket may be purchased with or without burn-in capability, as well as various connection options or latches. In conclusion, sockets for ICs, transistors provide a reliable medium for mounting an integrated circuit into an electrically protected environment. Many socket designs offer versatility and improved electrical performance, as well as the ability to easily connect the IC device to the printed circuit board. Socket products can be purchased for a variety of IC packages and are often customized with burn-in capability and various connection options or latches.

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