111227-HMC869LC5

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RF Evaluation and Development Kits, Boards are important components for the development of wireless radio products. With the advantages of cost-effective, they are popular in many fields. 111227-HMC869LC5 is a perfect example.

Application Field of 111227-HMC869LC5

111227-HMC869LC5 is a low-cost Wireless Power Amplifier (PA). It is based on a GaN-on-Diamond process and can achieve high linearity, clean spectrum, and good reliability. And it is suitable for many wireless applications including Wi-Fi, Bluetooth, GSM, CDMA, LTE, and more.

The 111227-HMC869LC5 can reach up to 10W of output power with 12V supply while the highest efficiency is 59%. It is also designed with 50Ω impedance matching and harmonic suppression filters on the board. It reduces size. Thanks to the integration of built-in filtering technology, 111227-HMC869LC5 can be used for Wi-Fi, GSM, CDMA, LTE and other communication systems.

The evaluation board of 111227-HMC869LC5 can incorporates common-mode filters and isolation transformers to provide a fully integrated RF subsystem for wireless applications. In addition, 111227-HMC869LC5 comes with a built-in temperature compensation circuits, which can effectively reduce device temperature drift.

Moreover, the 111227-HMC869LC5 evaluation board can detect and monitor the temperature of the semiconductor devices, providing a reliable temperature monitoring function.

Working Principle of 111227-HMC869LC5

111227-HMC869LC5 is a GaN-on-Diamond device with an integrated power amplifier. With this structure, it can provide a high level of linearity between input and output. Moreover, the high power output of 111227-HMC869LC5 can supply more than double the power of many existing power amplifiers.

Moreover, 111227-HMC869LC5 can use both DC and RF signals to operate. When DC is used, the DC-DC converter has a low noise level and can provide stable power to the device. The RF signal is used to control the operation of the device. When RF signal is applied, the PA will be immediately activated and it will operate at the predefined parameters.

111227-HMC869LC5 can provide a good linearity power gain. It also comes with the important features such as the temperature compensation circuit and on-chip monitoring circuit. Both features help ensure the operation of 111227-HMC869LC5 under different temperature conditions without affecting its performance.

Conclusion

111227-HMC869LC5 is a perfect example of cost-effective yet powerful RF Evaluation and Developing Kit. It can be used for many wireless applications such as Wi-Fi,GSM, CDMA, LTE and others. It offers high linearity power gain and temperature compensation technology, achieving excellent performance over a wide range of temperatures. With its built-in filtering technology, 111227-HMC869LC5 can be used to reduce size and complexity of the total RF system. All of these features make it an ideal component for wireless development.

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