114-83-328-41-117101

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Sockets for ICs, transistors, and other components are commonly found in many electronics applications, yet understanding their specific function and use can be tricky. This article will cover 114-83-328-41-117101 application field and working principle.

Types of Sockets

There are several different types of sockets for ICs and transistors:

• DIP/PIP: DIP stands for Dual In-Line Package, and these sockets are most commonly used with integrated circuits. They have two rows of pins and can be inserted directly into the board in a variety of configurations. PIP stands for Pin-In-Package, and these are used with nonstandard ICs, such as PLDs or FPGAs.
• SOP: Small Outline Package sockets are used with very small surface-mount devices. They have up to four pins.
• LGA: Land Grid Array sockets are used for larger integrated circuits and are mounted onto a board via their sites.
• QFP: Quad Flat Package sockets are used with very small integrated circuits, such as MCUs, and they have up to 64 pins.
• BGA: Ball Grid Array sockets are the smallest and most commonly used with integrated circuits. They have up to 2000 pins and make up a large portion of the surface-mount packages.

114-83-328-41-117101 Socket Application Field and Working Principle

The 114-83-328-41-117101 Socket is a Quad Flat Package (QFP) socket used with integrated circuits such as microcontrollers. These sockets provide a secure connection between the integrated circuit and the printed circuit board, and help protect against possible damage due to vibration, thermal expansion, and other environmental factors. It is designed to accept a variety of different components ranging from 32 to 84 pins.

The 114-83-328-41-117101 socket is designed with 0.5 mm pitch and 4 rows of pins for easy installation and handling. It features 8 finger connections per side, providing a secure connection between the IC and the circuit board. There are two contact pins at each end of the socket, which provide power and ground connections.

The main working principle of the 114-83-328-41-117101 socket is thermal isolation by having a thin layer of silicone between the IC and the board. This layer of insulation helps to prevent damage caused by excessive amounts of heat from the IC, as well as to reduce the effects of environmental conditions on the IC. The socket also has a spring-loaded plunger that stabilizes the IC, preventing it from vibrating or moving around while in use.

The 114-83-328-41-117101 socket is used for a variety of applications, including: automotive electronics, medical equipment, consumer electronics, and industrial automation. Its secure connections and thermal insulation characteristics make it suitable for any project, from the smallest to the largest.

Conclusion

The 114-83-328-41-117101 socket is a versatile and reliable way to protect integrated circuits from excessive heat and environmental conditions, while providing a secure connection for power and data transmission. Its multiple finger connections provide a secure fit and are ideal for applications ranging from the smallest to the largest.

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