
Allicdata Part #: | 115-87-422-41-001101-ND |
Manufacturer Part#: |
115-87-422-41-001101 |
Price: | $ 0.57 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Preci-Dip |
Short Description: | CONN IC DIP SOCKET 22POS GOLD |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
558 +: | $ 0.51529 |
Termination: | Solder |
Contact Resistance: | 10 mOhm |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.095" (2.41mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | -- |
Contact Finish - Post: | Tin |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 115 |
Features: | Open Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | Flash |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 22 (2 x 11) |
Type: | DIP, 0.4" (10.16mm) Row Spacing |
Part Status: | Active |
Packaging: | Tube |
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Introduction
The 115-87-422-41-001101 application is designed to provide a wide range of sockets and connectors for integrated circuits (ICs), transistors, and related components. This technology has been designed to provide superior performance in a variety of applications, from automotive to aerospace applications. The 115-87-422-41-001101 application is a specialized development tool for numerous types of high-power, multi-pin connection systems, and includes sockets for ICs, transistors, and related components. This technology provides superior performance in applications where current handling, resistance to thermal shock, and signal integrity are required in demanding environments.
History
The development of the 115-87-422-41-001101 application is the result of several decades of innovation and advances in the electronics industry. The first generation of IC sockets and connectors were developed in the early 1970s by Bell Labs, when the company was experimenting with ways to make better connections between ICs and transistors. Since then, IC sockets have undergone numerous advances and developments, which have eventually resulted in the current design of the 115-87-422-41-001101 application.
Features
The 115-87-422-41-001101 application includes a variety of features that make it well suited for use in high-power and multi-pin connection systems. These features include:
- High current rating up to 130~mA.
- High signal integrity with low resistance.
- Thermal shock resistance up to 1,500°C.
- Stable operation temperatures ranging from -55°C to +200°C.
- High vibration and shock resistance.
- Built-in EMI shielding to protect sensitive components.
Design and Operation
The 115-87-422-41-001101 application uses a unique design that combines different pin sizes, materials, and configurations in order to provide superior current handling, resistance to thermal shock, and signal integrity. The socket\'s design also allows for a custom connection between ICs and transistors, allowing for efficient and reliable operation in demanding environments. The socket\'s design also includes features such as built-in EMI shielding and robust construction for high-vibration and shock resistance.
The socket\'s design works by using spring-loaded contacts that are inserted into soldered terminals. The spring-loaded contacts firmly grip the pins of each IC or transistor, providing a secure connection and reliable data transmission. When in use, the socket\'s design helps to prevent any unintentional breakage or short circuiting from taking place. As the socket is designed for multi-pin connection systems, it can easily accommodate ICs and transistors of varying sizes and configurations.
Conclusion
The 115-87-422-41-001101 application provides a unique design that is well suited for use in a variety of applications. This includes ICs, transistors, and related components, as well as in systems requiring high current handling, resistance to thermal shock, and signal integrity. The socket\'s design includes features such as built-in EMI shielding and robust construction that provides superior shock and vibration resistance. Additionally, the socket\'s design includes spring-loaded contacts for improved secure connections and data transmission.
The specific data is subject to PDF, and the above content is for reference
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