115-91-648-41-001000

Integrated Circuits (ICs) and transistors play a key role in the advancement of technology in our modern world. They are used in almost all aspects of electronics, from data storage, digital signal processing, and communications, to control logic and microprocessors. Socket-style ICs, transistors, and other semiconductor devices can provide a means of quickly connecting components to a circuit board. The 115-91-648-41-001000 socket is an example of such a device.

The 115-91-648-41-001000 socket is designed to fit a wide variety of ICs, transistors, and other semiconductor devices. It is a PCB-mounted socket with a connection pitch of 0.4mm and pin count of 41. The socket is constructed from an insulated material and its contact points are plated in gold. This ensures that the electrical connection between the socket and the IC or transistor remains secure and reliable.

The 115-91-648-41-001000 socket is designed for automated IC placement and STM (Semiconductor Test Machine) operations. The socket is designed to mount and position the IC or transistor safely and accurately on the circuit board. This ensures that the IC’s or transistor’s electrical connections are correctly aligned and that proper electrical connections are established. The socket also serves as a passive heat sink, dissipating any heat generated by the IC or transistor. This prevents damage to the device and keeps it functioning properly.

The 115-91-648-41-001000 socket is used in applications requiring additional out-of-the-box protection for the IC or transistor. It can be used to protect against ESD, vibration, mechanical shock, and other environmental conditions. It can also be used to reduce lead-free solder connections as an alternative to standard leaded solder connections. The socket also provides additional protection against thermal expansion by supporting 1.2mm pitch and 0.5mm thick ICs and transistors.

The 115-91-648-41-001000 socket is an essential part of any electronic system. It provides reliable and secure connections between ICs, transistors, and the printed circuit board, and can protect against external environmental conditions. It also allows for automated IC placement and greater flexibility in the placement of components, ensuring that the circuitry and signal flow remain correctly aligned and working as intended.