116-83-320-41-004101 Allicdata Electronics
Allicdata Part #:

116-83-320-41-004101-ND

Manufacturer Part#:

116-83-320-41-004101

Price: $ 2.20
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN IC DIP SOCKET 20POS GOLD
More Detail: N/A
DataSheet: 116-83-320-41-004101 datasheet116-83-320-41-004101 Datasheet/PDF
Quantity: 1000
168 +: $ 1.99609
Stock 1000Can Ship Immediately
$ 2.2
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 116
Features: Elevated, Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, transistors and other components have been around for many years. For decades they have served as a reliable connection between numerous electrical components. However, in recent years, an even more reliable connection has been developed – 116-83-320-41-004101 application field and working principle.

The 116-83-320-41-004101 application field and working principle are designed to provide enhanced performance capabilities, increased signal integrity and a secure, reliable connection between various components. This technology is based upon the development of a new socket design and the use of specialized electrical connections.

By using a combination of micro-interconnects, transmission line structure, and high frequency boards: the 116-83-320-41-004101 application field and working principle all support the ultra-high speed and high power signal transmission needed for most modern applications. This combination creates a seamless connection between components that prevents material degradation, crosstalk, or radiation interference, while improving signal integrity and reducing power consumption.

The 116-83-320-41-004101 application field and working principle are capable of supporting the highest level of performance even in the most harsh and hostile environment. It is also equipped with an on-board power supply that is capable of powering all external devices requiring electrical current. In addition, the casing of the socket is designed to keep out water, dust, and other contaminants, while the material itself can withstand a wide range of operating temperatures from -200 to +200 degrees Celsius.

The 116-83-320-41-004101 application field and working principle are ideal for applications in industrial and military sectors, as they are able to provide a reliable, secure, and efficient connection between components. The application field offers an efficient design that creates a strong mechanical connection between the components. This is perfect for applications that require an extended life expectancies, such as automotive, aerospace, and military applications.

The working principle of the 116-83-320-41-004101 application field and working principle is based upon the use of a patented conductive alloy. The alloy is designed specifically for high power, high-speed applications, and it provides impressive performance and speed. The alloy is able to efficiently transfer signals at ultra-high speeds while providing the most secure connection possible.

In addition to providing high performance, the 116-83-320-41-004101 application field and working principle are also designed to be cost effective. By using only two components and a specialized electrical connection, it is able to reduce both material and installation costs. This ensures the long-term cost savings for the user, while also providing the highest level of performance.

Overall, the 116-83-320-41-004101 application field and working principle are designed to provide the highest level of performance and reliability in satellite applications. With the combination of a patented alloy and specialized connections, this technology is able to deliver the highest quality connection, improved signal integrity, and a secure and reliable connection between components.

The specific data is subject to PDF, and the above content is for reference

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