116-83-328-41-003101 Allicdata Electronics
Allicdata Part #:

116-83-328-41-003101-ND

Manufacturer Part#:

116-83-328-41-003101

Price: $ 1.74
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN IC DIP SOCKET 28POS GOLD
More Detail: N/A
DataSheet: 116-83-328-41-003101 datasheet116-83-328-41-003101 Datasheet/PDF
Quantity: 1000
210 +: $ 1.57458
Stock 1000Can Ship Immediately
$ 1.74
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 116
Features: Elevated, Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Sockets for ICs, transistors, and other miniaturized electronic components are electronic components with a variety of shapes and sizes. They are designed to make mounting of integrated circuits (ICs) and other kinds of components easier and more efficient. The 116-83-328-41-003101 application field and working principle is an example of a type of socket specifically designed for ICs.

What Is 116-83-328-41-003101?

116-83-328-41-003101 is a type of socket designed for ICs, transistors and other miniaturized electronic components. It is part of a larger family of sockets, each of which has a specific application field and associated working principles. The sockets are generally made from plastic, but the specific construction depends on the precise application.

116-83-328-41-003101 Application Field

The 116-83-328-41-003101 application field is for mounting and sheet mounting of ICs, transistors, and other small components. The socket has a number of features that make it ideal for this purpose. It has an insulating layer between the mounting pads and the ICs contact pads, which helps to reduce the risk of short circuits. It also has a wide variety of possible configurations, with multiple size and shape options. The number of mounting pads can vary, which makes it easy to adjust to the specific component size and shape.

116-83-328-41-003101 Working Principle

The 116-83-328-41-003101 working principle is simple and straightforward. The princple it works on is to create a housing for the components. This can be achieved with various mechanisms, including slide-in, snug-fit, compression fit, or other similar techniques. A secure and reliable connection is then achieved by interconnecting the components with a metal or ceramic material. The connection is usually made with electrical cables, wires or other parts. Depending on the application, the socket can also be used to secure the components in place during assembly.

Conclusion

The 116-83-328-41-003101 field is designed to facilitate the mounting and sheet mounting of ICs, transistors, and other miniaturized electronic components. It works by creating a housing for the components and interconnecting them securely with electrical cables, wires, or other parts. The socket has a variety of features, including an insulating layer between mounting pads and IC contact pads, to reduce the risk of electric shock.

The specific data is subject to PDF, and the above content is for reference

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