Allicdata Part #: | 116-87-650-41-006101-ND |
Manufacturer Part#: |
116-87-650-41-006101 |
Price: | $ 2.07 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Preci-Dip |
Short Description: | CONN IC DIP SOCKET 50POS GOLD |
More Detail: | N/A |
DataSheet: | 116-87-650-41-006101 Datasheet/PDF |
Quantity: | 1000 |
176 +: | $ 1.87823 |
Termination: | Solder |
Contact Resistance: | 10 mOhm |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.125" (3.18mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | -- |
Contact Finish - Post: | Tin |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 116 |
Features: | Elevated, Open Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | Flash |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 50 (2 x 25) |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Part Status: | Active |
Packaging: | Tube |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Socket technology is widely used in communications and consumer electronics, and can be seen in many devices, such as computers, mobile phones, tablets, and TVs. Through this type of connection, electric components, such as integrated circuits (ICs), transistors, diodes, LEDs, optoelectronics, and capacitors, can be connected to a printed circuit board (PCB).
In the electrical engineering world, one type of communication technology is referred to as the 116-87-650-41-006101 application field. This application field is specifically designed for ICs, transistors, and other components that require electrical signals to be transmitted between them. This technology is commonly used in a wide range of applications, such as data storage, data communication, memory chips, and integrated circuits.
The 116-87-650-41-006101 application field works on a basic principle. When an electronic component is placed in the socket, it is connected to the socket’s terminals, which are then connected to the PCB. This allows the electrical signals to travel from the device to the board. As the device is connected to the socket, the socket also transmits the electrical signals, allowing the board to detect them and process them accordingly.
The main goal of the 116-87-650-41-006101 application field is to provide a cost-effective solution for connecting components to the PCB. This means that an engineer can easily create a board that contains all of the necessary components, without having to invest huge amounts of money on using costly soldering techniques.
In order to make use of the 116-87-650-41-006101 application field, it is necessary to use ICs, transistors, and other components that are compatible with this type of technology. This ensures that the electrical signals are correctly transmitted from the components to the PCB. In some cases, the socket may also require specific types of tools to ensure that the connection is secure.
The 116-87-650-41-006101 application field is also beneficial in terms of time and energy efficiency. Once the components have been placed in the sockets, they can stay in place for a longer period of time, thereby allowing the engineer to focus on other tasks. This helps to reduce the amount of time it takes to make a PCB. As such, it is a great way to save both time and money when working on a project.
In conclusion, the 116-87-650-41-006101 application field is a great tool for engineers and technicians who need to connect ICs, transistors, and other components to a PCB. It is important to ensure that the components are compatible with this technology, as this will ensure that the electrical signals are correctly transmitted between them. This technology also helps to save time and money, as it eliminates the need for costly soldering techniques.
The specific data is subject to PDF, and the above content is for reference
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