1181 X 1" RF/IF and RFID

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RFI and EMI shielding and absorbing materials are essential components for noise reduction and energy efficiency in today’s electronic and electrical systems, reducing both emissions and susceptibility. 1181 X 1" is a highly effective EMI shielding material designed to provide versatile, cost-efficient and reliable protection for sensitive electronics.

As one of the most versatile and popular EMI shielding materials, 1181 X 1" shields against static and dynamic electric fields as well as unwanted electromagnetic emissions, making it suitable for a wide range of applications. It can be used in high temperature areas and low signal-to-noise ratios, making it a suitable shielding material for LTE, microwave, and other applications.

1181 X 1" is a highly effective shielding material as it is made of a double-layer, tin-plated copper consisting of an inner layer and a woven outer layer. The inner layer is a flexible and highly conductive aluminum-titanium eutectic, which is then tin-plated to prevent corrosion. The outer layer is a woven copper material that provides a rugged outer layer and a medium for mechanical bonding. Together these layers provide an effective shield that is light-weight yet strong, providing superior protection against interference.

For lower frequency applications, the shielding performance of 1181 X 1" is increased by incorporating the use of additional conductive layers. These extra layers add more shielding and increase frequency coverage. This means that 1181 X 1" provides exceptional shielding across a wide range of applications. It is also designed to be highly compatible with multiple other materials, making it a versatile shielding material.

1181 X 1" also works in tandem with absorptive materials, such as waveguide foam, thermoplastic elastomers, and enticement board, to provide additional shielding and absorb errant radiation. This combination of high shielding effectiveness and absorption results in fewer reflected emissions and improved energy efficiency. The combination of conductive and absorptive materials also reduces noise and minimizes crosstalk in sensitive applications.

The use of 1181 X 1" is not limited to EMI shielding applications, as it can also be used for RF and thermal protection. The shielding layer can also be coated with a material that provides a lower resistivity contact and better thermal conductivity to dissipate heat from sensitive electrical components. This material is especially useful for thermal management and ensuring that components don’t overheat.

In summary, 1181 X 1" is a highly effective and versatile EMI shielding material that is designed to provide superior protection against interference in both low and high frequency applications. It is made of a double-layer, tin-plated copper and includes additional layers for improved shielding and frequency coverage. 1181 X 1" also works in tandem with absorptive materials to improve energy efficiency and eliminate unwanted crosstalk. Along with RF and thermal protection, 1181 X 1" is a reliable and cost-effective solution for noise reduction and energy efficiency in today’s electronic and electrical systems.

The specific data is subject to PDF, and the above content is for reference