12-823-90C Allicdata Electronics
Allicdata Part #:

A805AR-ND

Manufacturer Part#:

12-823-90C

Price: $ 5.79
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 12POS GOLD
More Detail: N/A
DataSheet: 12-823-90C datasheet12-823-90C Datasheet/PDF
Quantity: 1000
1 +: $ 5.26050
25 +: $ 4.24696
100 +: $ 3.43791
500 +: $ 2.83122
1000 +: $ 2.62899
Stock 1000Can Ship Immediately
$ 5.79
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.140" (3.56mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: Vertisockets™ 800
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 12 (2 x 6)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, Transistors is a type of integrated circuit (IC) socket designed to allow for the efficient and reliable connection of an integrated circuit (IC) package to a printed circuit board (PCB). The 12-823-90C is a type of socket designed for use with ICs, transistors and other components with a small lead spacing, and is able to provide reliable and efficient connections between ICs, transistors and PCBs.The 12-823-90C socket is made up of a base and a top portion that attaches to the base, both of which are made of phenolic or paper-based material. The base includes a pair of mating terminals that connect to the IC or transistor, while the top portion has an In-Line Spring Connector that contacts the PCB. The spring connector is designed to provide precise and reliable contact between the PCB and socket, even in high-vibration environments.The primary application of the 12-823-90C socket is in the connecting of IC packages to PCBs. It is most commonly used when connecting to ICs, transistors and other components with a small lead spacing, such as microprocessors, memory chips, oscillators and gate arrays. The socket is also suitable for use with a range of other small-sized components such as diodes, inductors and capacitors. Additionally, the 12-823-90C socket is also suitable for use with modules such as power management ICs and memory modules.In terms of its operation, the 12-823-90C socket works by providing an electrical, mechanical and thermal interface between the IC package and the PCB. When an IC package is inserted into the socket, the spring connector on the top portion of the socket provides a secure connection between the socket and the PCB. The spring connector is designed to be robust enough to make secure contact despite the socket and IC package experiencing vibration due to environmental conditions such as thermal cycling and shock.The socket is also designed to ensure consistent electrical and mechanical connection between the PCB and the IC package, thus allowing the IC to work in the most efficient way. The more reliable connection provided by the socket helps to reduce errors related to poor contact, such as open-circuit losses, short-circuit losses, and drops in signal integrity. This helps ensure that the system is more reliable and less prone to errors.In summary, the 12-823-90C socket is a type of IC socket designed for use with ICs, transistors and other components with a small lead spacing. It is most commonly used for connecting IC packages to PCBs, but is also suitable for use with a range of other small-sized components. The socket is designed to provide a reliable electrical, mechanical and thermal interface between the IC package and the PCB, thus allowing the IC to work in the most efficient way. This helps to reduce errors related to poor contact, thereby ensuring that the system is more reliable and less prone to errors.

The specific data is subject to PDF, and the above content is for reference

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