
Allicdata Part #: | 12313-42441001000-ND |
Manufacturer Part#: |
123-13-424-41-001000 |
Price: | $ 11.56 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Mill-Max Manufacturing Corp. |
Short Description: | CONN IC DIP SOCKET 24POS GOLD |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
64 +: | $ 10.50650 |
Termination: | Wire Wrap |
Contact Resistance: | -- |
Current Rating: | 3A |
Material Flammability Rating: | -- |
Termination Post Length: | 0.510" (12.95mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Contact Material - Post: | Brass Alloy |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 123 |
Features: | Open Frame |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Type: | DIP, 0.4" (10.16mm) Row Spacing |
Part Status: | Active |
Packaging: | Tube |
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Sockets for ICs, Transistors
Over the years, sockets for ICs, transistors, and other electronic components have become increasingly popular in applications ranging from circuit prototyping to high-performance board design. As the complexity and speed requirements of modern integrated circuits increase, developing a viable system for attaching devices to printed-circuit boards has become one of the chief challenges facing electronics engineers. The conventional solution for connecting devices to a printed-circuit board is to use a set of gold plated copper pins, known as a socket.
Types of Sockets
Most chips come with specialized sockets designed specifically for their type of chip. The most common types of sockets are DIP (dual in-line package) sockets, SOIC (small outline integrated circuit) sockets, and SSOP (shrink small outline package) sockets. DIP sockets are designed for chips with two rows of pins, while SOIC and SSOP sockets are designed for chips with multiple rows of pins. The differences among sockets are determined primarily by their pin sizes, contact shapes, and connection styles.
Sockets for ICs
One of the most common types of sockets for ICs is the DIP, or dual in-line socket. A DIP socket is designed for use with Integrated Circuits with two rows of pins in a line, and it provides electrical connection between a circuit board and the component. DIP sockets typically have two or more rows of pins that are soldered into a Printed Circuit Board (PCB). They can also be soldered onto a board directly or used as a plugable component.
When selecting DIP sockets, it is important to take into consideration the size of the device, the number of pins, the pitch of the pins, and the power requirements of the chip. Generally, DIP sockets are available in sizes ranging from 9 to 20 pins and come in a variety of different pitches, such as 5mm, 10mm, and 15mm. The most common DIP socket is the 14-pin socket, which is designed for use with 14-pin devices.
Sockets for Transistors
Sockets for transistors have significantly fewer pins than sockets for ICs, usually ranging from 3 to 8 pins. These sockets are designed to accommodate large and small-signal transistors. The type of socket chosen should match the package and pin configuration of the transistor being used. Commonly used transistor socket types include the 8-pin ceramic header, the 8-pin plastic header, 8-pin radial lead, and 8-pin bent pin header socket.
Transistor sockets usually consist of an array of pins that connect the device to the circuit board. The pins may be soldered directly to the circuit board or to a header, which allows for easy socketing and un-socketing of the component. Socketing the transistor ensures low contact resistance, which helps to reduce energy losses and minimizes device heat dissipation.
133-13-424-41-001000 Application Field and Working Principle
The 133-13-424-41-001000 is a standard two-row DIP socket designed for Surface Mount ICs. It features two rows of 8 contacts that allow for easy socketing of the IC and is compatible with a range of Surface Mount devices. The pins are made of gold plated copper, which helps to resist oxidation and contamination and ensures low contact resistance.
In operation, the device is simply plugged into the socket, whereby the pins are connected to their respective contact points within the integrated circuit. This allows for electrical signals to be sent and received from the device and other components in the circuit. The 133-13-424-41-001000 socket is suitable for use in a wide range of applications, including circuit prototyping, high-performance board design, and other projects requiring a reliable connection between a PCB and a Surface Mount device.
The specific data is subject to PDF, and the above content is for reference
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