123-13-640-41-801000 Allicdata Electronics
Allicdata Part #:

12313-64041801000-ND

Manufacturer Part#:

123-13-640-41-801000

Price: $ 15.67
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN IC DIP SOCKET 40POS GOLD
More Detail: N/A
DataSheet: 123-13-640-41-801000 datasheet123-13-640-41-801000 Datasheet/PDF
Quantity: 1000
50 +: $ 14.10700
Stock 1000Can Ship Immediately
$ 15.67
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: --
Termination Post Length: 0.510" (12.95mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 123
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, transistors, and other semiconductors make up the backbone of computer technology. In this article, we will discuss the application field and working principle of the 123-13-640-41-801000 socket.

This particular socket was designed for connecting ICs, transistors, and other semiconductors to electronic circuits and systems. The socket is made up of five distinct elements: the base, contacts, strain relief, lead, and die attached to the contact. The base is attached to the circuit board of the system, and the contacts provide functional connections from the integrated circuit onto the circuit board.

The strain relief features an oversized hole which helps in securing the contacts against strain due to stress during installation or use. The lead is used to secure the IC to the base, and the die is prepared at a microscopic level to ensure good electrical and mechanical connection between the IC and the base.

The socket is designed to withstand extremely high temperatures and voltages, making it ideal for high-power applications. It also provides robust reliability and is resistant to vibration, dust, and moisture. Additionally, the socket features an auto-recovery fuse, allowing it to automatically repair itself in the event of a short-circuit.

As far as its working principle goes, when power is applied to the socket, the contacts in the base complete an electrical circuit. The die and lead also provide reliable electrical and mechanical connections, respectively, further ensuring proper functioning of the IC to the circuit board.

The 123-13-640-41-801000 socket is an excellent choice for a variety of applications, ranging from consumer electronics and medical devices to automotive and defense. It is also suitable for high-power applications such as industrial equipment and energy systems.

In conclusion, the 123-13-640-41-801000 socket is an advanced, reliable, and durable device for connecting ICs, transistors, and other semiconductors to electronic circuits and systems. The socket has proven to be a popular choice for a variety of applications, thanks to its excellent performance, robust reliability, and high temperature and voltage resistance.

The specific data is subject to PDF, and the above content is for reference

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