123-43-624-41-001000 Allicdata Electronics
Allicdata Part #:

ED90175-ND

Manufacturer Part#:

123-43-624-41-001000

Price: $ 2.26
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN IC DIP SOCKET 24POS GOLD
More Detail: N/A
DataSheet: 123-43-624-41-001000 datasheet123-43-624-41-001000 Datasheet/PDF
Quantity: 1000
272 +: $ 2.05285
Stock 1000Can Ship Immediately
$ 2.26
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: --
Termination Post Length: 0.510" (12.95mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 123
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

123-43-624-41-001000 application field and working principle

A socket is an electronic component used for connecting integrated circuits (ICs), transistors, and other types of electronic components. Sockets are used in many applications, the most common being for interconnects between chips on a circuit board, or as an interface between a board and a different system. Sockets can be designed for a variety of purposes, including signal transfer, analog switching, power delivery, and signal conditioning.

A socket is designed for a specific purpose, and requires the correct combination of parts in order to work correctly. For example, a socket for an analog switching application must have a dielectric material with a low leakage current in order to reduce noise. A socket for a signal conditioning application must have a low self-inductance, in order to reduce unwanted fast transients. Power transistors, for example, must have a low on resistance in order to reduce power dissipation.

When considering the application of a socket, the first step is to determine the number of pins required for connection. Sockets are designed with a variety of pin configurations, including dual inline (DIP) packages, SOICs, QFNs, and others. Once the pin configuration is determined, the material of the contact points and the type of plating must be considered.

Plating materials can be copper (Cu), nickel (Ni), or gold (Au). Copper plating is commonly used in many applications because it offers good electrical and thermal conductivity. However, it is not suitable for high power applications, as it exhibits poor wear resistance. Nickel plating provides better electrical properties than copper plating, but is also not suitable for high power applications due to its poor wear resistance. Gold plating, on the other hand, is the most suitable for high power applications, as it offers excellent electrical and wear resistant properties.

The material of the contact points must also be considered. Many contact points are made from a combination of different materials, including phosphor bronze and beryllium copper. Phosphor bronze is commonly used for low current applications, as it offers good electrical and mechanical properties. Beryllium copper is often used for high current applications, as it offers excellent electrical and thermal conductivity. The contact force of the contact points must also be considered, as it will affect the reliability and performance of the socket.

Once the material, plating, and contact force have been selected, the application field must be identified. Examples of application fields include automotive, industrial, electronics, and consumer. Each application field has its own requirements, and the socket must be designed to meet these requirements. For example, automotive applications require temperature tolerant materials and contact points with a higher mechanical strength. Industrial applications require a socket that offers immunity to EMI/RFI. Electronics applications require a socket with a low self-inductance, while consumer applications require a socket with a low mounted height.

The socket must also be designed to provide the correct level of protection. This includes mechanical protection against dust, moisture, and other contaminants, as well as thermal protection. In addition, the socket must be designed to provide the correct level of impedance for signal integrity.

Designers must also take into account the types of components in the application. ICs require the most attention, since they are the most prone to failure due to their sensitive components. For ICs, the socket must be designed to provide proper contact forces, low contact resistance, and low EMI levels. Transistors also require a socket with the correct contact geometry to ensure proper signal integrity. Finally, switches require a socket with low contact resistance and correct switching time.

In summary, the design of a socket requires careful consideration of the application field, number of pins needed for connection, contact materials and plating, contact forces, impedance, and the types of components in the application. By taking these factors into account, designers ensure that their socket will correctly and consistently perform in their application.

The specific data is subject to PDF, and the above content is for reference

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