124-83-308-41-002101 Allicdata Electronics
Allicdata Part #:

124-83-308-41-002101-ND

Manufacturer Part#:

124-83-308-41-002101

Price: $ 0.73
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN IC DIP SOCKET 8POS GOLD
More Detail: N/A
DataSheet: 124-83-308-41-002101 datasheet124-83-308-41-002101 Datasheet/PDF
Quantity: 1000
477 +: $ 0.65889
Stock 1000Can Ship Immediately
$ 0.73
Specifications
Termination: Wire Wrap
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.630" (16.00mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 124
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Sockets for ICs, Transistors

The 124-83-308-41-002101 application field and working principle relate to the use of sockets for ICs, transistors, and other components. This type of socket is used by engineers, electrical technicians, and other professionals in a variety of industries and fields. The purpose of using these sockets is to allow engineers and technicians to easily, effectively, and safely install components and to ensure that the components remain securely in place while in use.

Sockets for ICs, transistors, and other components are specially designed in order to provide easy access and secure connection for various types of circuit boards. The most common types of sockets are DIP, TSSOP, and DFN. DIP stands for Dual In-line Package and is one of the most popular types of sockets. These sockets are especially suitable for use with DIP packages and allow for easy installation and removal of components.

TSSOP stands for Thin Shrink Small Outline Packaged and is designed for use with the special miniature packages. DFN stands for Dense Fine-pitched Numbering which is mainly used for surface-mount components. There are also other types of sockets, such as the quad flat package sockets which are used for integrated circuits, or ICs, and are available in different sizes and pitches.

Sockets for ICs, transistors, and other components also come in a variety of other forms such as the zero insertion force (ZIF) sockets which allow for easier component insertion and removal. Other types of sockets include sockets with adjustable height, or height sockets, which allow the components to be placed at any level depending on the size and type of the component. There are also different types of outlets such as the pin grid array (PGA) sockets which are used for ICs and are especially useful in high-density circuits.

When working with sockets for ICs, transistors, and other components, it is important to ensure that the component is properly secured in the socket. This is usually done through the use of spring pins, which are usually pushed down into the socket by the component and then secured in place. Once the pins have been properly secured, the component can be easily inserted or removed from the socket.

The 124-83-308-41-002101 application field and working principle refers to the use of these types of sockets for ICs, transistors, and other components.These sockets are versatile and easy to use, making them an excellent choice for a wide variety of applications. By using these sockets, engineers and technicians can ensure that components remain securely in place while in use and can also be easily installed and removed when needed.

The specific data is subject to PDF, and the above content is for reference

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