| Allicdata Part #: | 12493-95241002000-ND |
| Manufacturer Part#: |
124-93-952-41-002000 |
| Price: | $ 13.81 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Mill-Max Manufacturing Corp. |
| Short Description: | CONN IC DIP SOCKET 52POS GOLD |
| More Detail: | N/A |
| DataSheet: | 124-93-952-41-002000 Datasheet/PDF |
| Quantity: | 1000 |
| 56 +: | $ 12.55720 |
| Termination: | Wire Wrap |
| Contact Resistance: | -- |
| Current Rating: | 3A |
| Material Flammability Rating: | -- |
| Termination Post Length: | 0.630" (16.00mm) |
| Operating Temperature: | -55°C ~ 125°C |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Contact Material - Post: | Brass Alloy |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Finish - Post: | Tin-Lead |
| Pitch - Post: | 0.100" (2.54mm) |
| Series: | 124 |
| Features: | Open Frame |
| Mounting Type: | Through Hole |
| Contact Material - Mating: | Beryllium Copper |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Finish - Mating: | Gold |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions or Pins (Grid): | 52 (2 x 26) |
| Type: | DIP, 0.9" (22.86mm) Row Spacing |
| Part Status: | Active |
| Packaging: | Tube |
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Sockets for ICs, Transistors are components that make it easy to connect and disconnect electrical components. They are widely used in the consumer, industrial, automotive, aerospace and military industries. Commonly used sockets include D-Subminature, BGA (Ball Grid Array) and Flip Chip Sockets. Sockets are used to connect ICs, transistors and other components to a printed circuit board (PCB).
The primary advantage of a socket for an IC, transistor is that it allows easier replacement of components in case of failure or during redesign. This reduces repair time and costs and avoids costly restocking. It also allows better testing of components due to faster disconnection and reconnection.
The basic socket design is fairly straightforward. A socket consists of a molded plastic or ceramic housing with multiple terminals along its edge or top. The terminals are connected to a printed circuit trace or to a circuit board or other electronic component. The fit between the terminals and the component being connected must be precise in order to ensure a good electrical connection.
The workings of a socket for ICs, transistors vary slightly depending on the type of socket. For example, D-Subminature sockets are designed for through-hole construction, while BGA and flip chip sockets are designed for surface-mount construction. In a D-Subminature socket, a lead from the component passes through a hole in the socket. The lead is inserted into the hole and then soldered to the board. In a BGA or flip chip socket, the component is simply placed on top of the socket. The socket then holds the component in place with the aid of pins or other connectors.
Another type of socket is a “quick-connect” or “push-in” socket. This type of socket is designed for use with components that have pins or leads that can be plugged directly into the socket without the use of a soldering iron. This type of socket is often used in consumer applications such as electronics, audio, video and other applications where components must be frequently replaced or altered.
Each type of socket for ICs, transistors has its own advantages and disadvantages. For example, D-Subminature sockets provide mechanical stability but require manual assembly and are more likely to be damaged during installation. BGA and Flip Chip sockets are more suitable for automated assembly processes, but they are more expensive and have a smaller range of tolerances. Push-in sockets are less expensive and can provide efficient replacement of components but are more prone to failure if not properly installed.
Sockets for ICs, transistors offer various levels of performance and reliability. Careful selection of the right socket for the job is essential for ensuring performance and reliability. Choosing the wrong socket can result in damaged components, signal degradation or product failure.
The specific data is subject to PDF, and the above content is for reference
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124-93-952-41-002000 Datasheet/PDF