126-43-632-41-001000 Allicdata Electronics
Allicdata Part #:

126-43-632-41-001000-ND

Manufacturer Part#:

126-43-632-41-001000

Price: $ 10.56
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN IC SKT DBL
More Detail: N/A
DataSheet: 126-43-632-41-001000 datasheet126-43-632-41-001000 Datasheet/PDF
Quantity: 1000
60 +: $ 9.59651
Stock 1000Can Ship Immediately
$ 10.56
Specifications
Series: *
Part Status: Active
Description

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Sockets for ICs, Transistors play the important role of connecting integrated circuit (IC) components with their circuit boards while also driving the device. Such components range from transistors to sensors, memory chips, and microcontrollers. Socket for ICs, transistors come in various forms, with different materials, voltages, and die-sizes. In this article, let’s go through the different types of sockets and their respective features, along with the application field and working principle of the 126-43-632-41-001000 socket.

Types

Firstly, there are various types of sockets for ICs, transistors, including:

  • Test Socket: Test socket is used to test the performance of the IC before the assembly on the board. It is designed to match up the IC leads and fit in different IC packages. And it also supports the static test before soldering.
  • ZIF Socket: ZIF socket stands for Zero Insertion Force socket. It is basically used to insert and eject the IC without any force. This type of socket helps to minimize the chances of broken legs.
  • Burn-in Socket: As the name suggests, Burn-In Socket is designed for Burn-in Test before using it in actual application. It is a precision tool that provides high electrical continuity, reduces heating effects, and minimizes damage to ICs during high temperature operations.
  • DIP Socket: DIP stands for Dual Inline Package. This type of socket is used to connect DIP ICs with their boards. It is available in a range of sizes, pin counts, and signal distances.
  • PLCC Socket: PLCC stands for Plastic Leaded Chip Carriers. This type of socket is used for Surface Mount Components (SMT) to integrate the IC with the board.

Features

Each socket for ICs, transistors exhibits specialized features in accordance with its respective type. Here are some of the features related to the various sockets that have been previously discussed.

  • Test Socket: spring-pin mechanism enables the socket to attach itself to the IC leads by pushing them inwards. Moreover, the heat-resistant material prevents the socket from getting damaged.
  • ZIF Socket: ZIF Socket supports the precise positioning of IC leads under zero insertion force. It also features an in-built temperature resistance of 150℃.
  • Burn-in Socket: this socket is designed to reduce the impact of high current and temperatures on the ICs during operations. Furthermore, it also minimizes the contact resistance between the IC and its board.
  • DIP Socket: this type of socket serves the purpose of connecting a DIP IC to the board. Such sockets are usually air-tight and made of good quality materials.
  • PLCC Socket: PLCC Socket is specially designed to withstand temperature and mechanical vibrations. It also minimizes reflection losses caused due to its integrated ground plane.

Application Field and Working Principle of 126-43-632-41-001000 Socket

The 126-43-632-41-001000 Socket is a DIP Socket. It is mainly used to connect DIP ICs to their boards with minimal disturbance. This socket is highly reliable, as it is designed to transmit with less contact resistance even during high-temperature operations. Its pins are created to fit the IC leads, the insertion process of the IC and the removal of it are quite easy.

The working principle of the 126-43-632-41-001000 Socket is based on high-performance spring pins, which helps in protecting the IC from any mechanical damage and secures the IC in its place. This feature also enables the socket to automatically adjusts its pins to the IC leads. Aside from this, the socket also brings additional benefits such as improved electrical connection and minimal signal reflection.

The specific data is subject to PDF, and the above content is for reference

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