
Allicdata Part #: | 13-0508-21-ND |
Manufacturer Part#: |
13-0508-21 |
Price: | $ 6.04 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN SOCKET SIP 13POS GOLD |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
13 +: | $ 5.49069 |
Termination: | Wire Wrap |
Contact Resistance: | -- |
Current Rating: | 3A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.360" (9.14mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polyamide (PA46), Nylon 4/6 |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Pitch - Post: | -- |
Series: | 508 |
Features: | -- |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 13 (1 x 13) |
Type: | SIP |
Part Status: | Active |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Sockets for ICs, transistors and other semiconductor devices are widely used across a variety of applications. Sockets are physical devices that provide mechanical and electrical connections between semiconductor devices and systems. They enable systems to access and manipulate data more quickly and reliably. In this article, we will explore the various application fields and working principles of sockets for ICs, transistors and other semiconductor devices.
Types of IC Sockets
There are two primary types of IC sockets: soldered and press-fit. In a soldered socket, the IC package is soldered directly to the socket. A press-fit socket utilizes a spring-like construction that securely locks the IC package in place without the need for soldering. Soldered sockets typically have better thermal properties and are often used in applications that require precise alignment and portability. Press-fit sockets are often used in applications that require frequent re-plugging, such as prototyping and debugging.
Applications of IC Sockets
IC sockets are widely used in a variety of applications, including embedded systems, power circuits, telecommunication systems, automotive electronics, and computers. In embedded systems, IC sockets provide a reliable connection between an application-specific integrated circuit (ASIC) and the system board. In telephone systems, IC sockets are used for connecting multiple field-programmable gate array (FPGA) chips, allowing engineers to easily configure the system without having to physically replace or reprogram the chips. In automotive electronics, sockets provide a stable and reliable connection between the ECU (engine control unit) and the onboard sensors and actuators. In computers, IC sockets provide an efficient way to send and receive data from the CPU to different components.
Working Principle of IC Sockets
The primary function of a socket is to provide a mechanical and electrical connection for the IC package. When an IC package is inserted into a socket, the contacts on the IC package make contact with the spring contacts on the socket. The spring contacts are seated in holes that form the electrical connection between the IC package and the board. The socket also serves as a heat sink to dissipate thermal energy from the IC package. Some advanced sockets may incorporate protective features such as shock detection, current diversion, and voltage isolation, which protect the IC package from damage.
Conclusion
Sockets for ICs, transistors and other semiconductor devices are used in a variety of applications, from embedded systems to computers. They provide a reliable and efficient way to transfer data between an IC package and the system board. Sockets can be either soldered or press-fit and are designed to provide both mechanical and electrical connections. Additionally, advanced sockets may feature protective features such as shock detection, current diversion, and voltage isolation.
The specific data is subject to PDF, and the above content is for reference
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