1318744-1 Allicdata Electronics

1318744-1 Connectors, Interconnects

Allicdata Part #:

1318744-1-ND

Manufacturer Part#:

1318744-1

Price: $ 1.76
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: GUIDE PIN FOR HS3
More Detail: N/A
DataSheet: 1318744-1 datasheet1318744-1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
2000 +: $ 1.60009
Stock 1000Can Ship Immediately
$ 1.76
Specifications
Series: --
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Accessory Type: Guide Pin
For Use With/Related Products: --
Specifications: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors, as the name implies, are designed to provide connection between electronic components and/or systems. Depending on the particular application, backplane connectors may be used to connect power, signal and control systems. The backplane connectors used in these applications have become increasingly more sophisticated as technological advances allow for more precise and secure connections between components.

The 1318744-1 is a High Density Console Connector from TE Connectivity, a company specializing in connectors and circuit protection solutions. This backplane connector is engineered to provide outstanding board-to-board connection integrity in space limited applications. It is widely used in a variety of industries, including telecommunications, computing, networking, electronic test equipment, medical, oil & gas, off-highway, and control systems.  

The 1318744-1 is made up of several components, designed to ensure secure and reliable connections. The core component is a dielectric compatibility (DC) shield, which is an integral part of the device. This shield helps to minimize crosstalk between the pins on different PCBs, and acts as a barrier to protect the electrical connections from external electromagnetic interference. The DC shield also protects against mishandling of the connectors, and ensures long-term durability and performance. Additionally, the connector is also fitted with terminal pins made of copper that are plated for corrosion resistance. The terminal pins can be placed in multiple positions, so that the assembly can be customized according to the needs of the application.

The 1318744-1 High Density Console Connector’s key features include high density with low profile design, increased termination force, four (4) high speed serial communication options, and an increased bandwidth (up to 50 Gbps) with better resilience against EMI. With the help of its ruggedized construction, the connector offers superior vibration resistance, superior durability, and improved system performance.

The 1318744-1 High Density Console Connector also provides low cycle life, reliable matings, and improved EMI protection characteristics. Its EMI protection characteristics help to reduce system failures, which is especially important in mission critical applications. It also includes a locking feature which ensures the connector stays mated in high vibration applications. This helps to ensure that the connection is secure and reliable.

In summary, the 1318744-1 High Density Console Connector is engineered to provide outstanding board-to-board connection integrity in space limited applications. Its design and construction makes it ideal for a variety of industries and applications, offering high-speed serial communication, increased bandwidth, and improved durability. Its key features include high density with low profile design, increased termination force, four (4) high speed serial communication options, and increased bandwidth with better resilience against EMI. It also provides a locking feature and improved EMI protection, making it ideal for mission critical applications where system failure is unacceptable. Its ruggedized construction also makes it ideal for high vibration applications.

The specific data is subject to PDF, and the above content is for reference

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