14-8875-310C Allicdata Electronics
Allicdata Part #:

14-8875-310C-ND

Manufacturer Part#:

14-8875-310C

Price: $ 5.75
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 14POS GOLD
More Detail: N/A
DataSheet: 14-8875-310C datasheet14-8875-310C Datasheet/PDF
Quantity: 1000
13 +: $ 5.22609
Stock 1000Can Ship Immediately
$ 5.75
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.140" (3.56mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 8
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 14 (2 x 7)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, transistors, and other components are essential when it comes to carrying out repairs or modifications to these devices. The 14-8875-310C socket is one such type of specialist socket designed to accommodate a particular type of integrated circuit package. This article will explore the application field in which the 14-8875-310C socket is best utilized and the working principle behind the device.

Application Field

The 14-8875-310C socket is a specialized product created specifically for a particular type of integrated circuit package, known as the QFN package type. This type of integrated circuit package is highly specialized and has a flat-topped, rectangular body, with numerous pins on the underside. It is often used for more compact, low-power applications. Different types of QFN packages are available, but the 14-8875-310C socket is specifically created to fit a particular type of QFN package.

The 14-8875-310C socket is most frequently used in applications that require frequent access to the circuitry, due to its ease of installation and removal. This includes applications such as automotive computer systems, medical technology, factory automation, and communications systems. As such, it is useful for making shorter-term modifications, or testing how changes to components will affect the overall system.

Working Principle

At first glance, the 14-8875-310C socket may appear to be a simple device, but it relies on some relatively complex technology. The device is designed to fit and securely mount a QFN package of the appropriate size. It features a number of connection points, which are also known as contact points, which make contact with the pins of the QFN package when it is inserted into the socket. These contact points are typically made from highly conductive metals such as copper or brass, and they are designed to ensure that electrical signals are transferred with the lowest possible resistance, while preventing damage to the pins.

The 14-8875-310C socket also incorporates a number of spring-loaded retention clips inside the socket, which hold the QFN package securely in position. This ensures a snug fit, while also allowing for easy insertion and removal of the package. Finally, the socket features a series of mounting holes around the outside of the package, which are used to secure the socket to a PCB board or other mounting surface.

In conclusion, the 14-8875-310C socket is an essential piece of equipment when it comes to installing or testing QFN packages. Its specialized design ensures that a particular type of QFN package is securely mounted to the socket and that electrical signals are transferred with minimal resistance. Furthermore, its spring-loaded clips and mounting holes make it suitable for a range of automotive, medical, industrial, and communications applications.

The specific data is subject to PDF, and the above content is for reference

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