146-87-310-41-035101

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A socket for ICs, transistors, designated as 146-87-310-41-035101, is primarily used for encapsulating integrated circuits, junction transistors, and other semiconductor devices. This device offers higher dielectric strength, better stress distribution, longer life and reduced assembly labor. It is also lighter and offers improved wear characteristics over traditional assemblies.

The 146-87-310-41-035101 socket is designed to work with surface mount and through hole components. It has an insulated plastic body designed to provide superior electrical insulation, plus mechanical stability. It is available in distinct designs for various types of packages, including Dual In-Line (DIP), Small Outline Transistor (SOT) and Thin Small Outline Transistor (TSOT). It is also available in different thickness levels and colors to accommodate different applications.

The application fields for the 146-87-310-41-035101 socket mainly include automotive, medical, consumer electronics and industrial control applications. In addition, this socket can also be used for prototyping, surface mounting, binning, reliability qualification testing and selecting samples.

The working principle of the 146-87-310-41-035101 socket is to provide encapsulation for the ICs, transistors, and other semiconductor devices. It is designed to allow the devices to be safely inserted or removed from a stable, correctly aligned target surface. This socket consists of two parts - a male portion known as a plug that fits into the socket and a female portion known as a socket that engages the plug. In addition, this socket is designed to provide electrical insulation and mechanical stability. This ensures that any delicate components are correctly oriented and securely held during operation.

The 146-87-310-41-035101 socket is an important part of any designs involving sensitive semiconductor components. It ensures that the components are properly protected and help in achieving higher performance, improved yields and better reliability. Its design is also compatible with many different types of packages and offers superior electrical insulation and mechanical stability. Thus, it is a valuable addition to any high-volume, precision-critical and reliable application.

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