16-0503-21

Termination:	Wire Wrap
Contact Resistance:	--
Current Rating:	3A
Material Flammability Rating:	UL94 HB
Termination Post Length:	0.360" (9.14mm)
Operating Temperature:	--
Housing Material:	Polyamide (PA), Nylon, Glass Filled
Contact Material - Post:	Brass
Contact Finish Thickness - Post:	10.0µin (0.25µm)
Contact Finish - Post:	Gold
Pitch - Post:	0.100" (2.54mm)
Series:	0503
Features:	--
Mounting Type:	Through Hole
Contact Material - Mating:	Beryllium Copper
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	16 (1 x 16)
Type:	SIP
Part Status:	Active
Packaging:	Bulk

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Sockets for ICs, TransistorsIntegrated circuits (ICs) and transistors are fundamental building blocks for most electronic products. The lack of reliable and long-lasting sockets limits the usefulness of these technologies and can ultimately determine the success of a new device. Manufacturers have created various solutions for these two electronic components, each with different performance characteristics and cost considerations. In order to properly integrate these components into a device, it is important to understand the application field they will be used in and the working principles of the socket designs. When selecting a socket for ICs and transistors, the environment in which the component will be used should be taken into consideration. Some applications, such as military or aerospace, require more durable and rugged sockets that can withstand extreme temperatures, humidity and impacts. Components used in consumer products, on the other hand, often need to be lightweight and compact. The working principle of a socket for ICs and transistors differs greatly depending on the application. Valved sockets provide the necessary current to the device while making a water-tight seal. These are used in many applications where a leak is unacceptable such as medical and scientific products. Insulated gate bi-polar junction transistors (IGBTs) require a different type of socket. These components generate heat and require a design that will allow for efficient thermal management. Accommodating larger, denser components is becoming more difficult as ICs and transistors continue to shrink in size. Manufacturers are now offering high-density sockets that are designed to fit multiple ICs and transistors in the same footprint. Pin-in-paste sockets are created by artificially connecting the die placed on the board directly with the component’s contacts, eliminating the need for a socket. This method is faster and cheaper than traditional socket designs, but not as reliable. The optimal socket design for ICs and transistors must be determined based on the application and the desired performance characteristics. This can be a difficult process, especially if the environment in which the component will be used is unknown. It is important to understand the working principles of the different socket designs as well as their characteristics and limitations in order to make the best choice.

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