16-3508-31 Allicdata Electronics
Allicdata Part #:

16-3508-31-ND

Manufacturer Part#:

16-3508-31

Price: $ 9.01
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 16POS GOLD
More Detail: N/A
DataSheet: 16-3508-31 datasheet16-3508-31 Datasheet/PDF
Quantity: 1000
7 +: $ 8.10719
Stock 1000Can Ship Immediately
$ 9.01
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.500" (12.70mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 508
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for various integrated circuits (ICs), transistors and other semiconductor components provide a secure and reliable connection between the physical components of a circuit board. They are often used to replace or upgrade existing components such as integrated circuits, transistors, and field-effect transistors. Over the years, the evolution of socket designs and applications has resulted in several distinct categories, each designed to meet the needs of different components and applications.

The 16-3508-31 socket is a type of surface-mount socket designed specifically for use with electronic components such as transistors and ICs. It is a self-aligning socket, which means that the components are held securely in place when the board is soldered or otherwise connected. It also features a double-locking system that ensures a secure connection. This type of socket is typically used in low-voltage applications, and has a very low profile which allows it to be used in tight spaces such as on high-density boards or mobile phones.

The 16-3508-31 socket is designed to accept an 8-pin standard IC package such as a BGA (Ball Grid Array). It has two power contacts and six signal contacts, allowing it to be connected to an existing circuit board or used for prototype development. The socket includes a rigid metal frame for superior alignment and soldering pins or pads that provide electrical connection with the board. In addition, it has two plastic inserts that provide additional support and stability during connection.

The working principle of the 16-3508-31 socket is simple and straightforward. When the components are placed into the socket, they are held securely in place and the pins of the socket make contact with the appropriate pads or conductors on the board. The pins of the socket provide the required electrical connection and the plastic inserts provide additional support and stability. This type of socket is designed for quick and easy installation, and can be reused as needed.

As technology continues to advance and more complex applications are implemented, the need for more efficient and reliable performance has increased. The 16-3508-31 socket provides an ideal solution for many types of semiconductor components and applications. It is well suited for use in low-voltage applications, and its secure connection, robust design, and low profile ensure that the components are held securely in place and the board is protected from damage.

In summary, the 16-3508-31 socket is a reliable and secure solution for use with electronic components such as transistors and ICs. It is designed for quick and easy installation, and its self-aligning and double-locking features provide a secure and lasting connection. This socket is suitable for low-voltage applications and provides superior alignment and stability for all types of semiconductor components.

The specific data is subject to PDF, and the above content is for reference

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