16-81250-610C Allicdata Electronics
Allicdata Part #:

16-81250-610C-ND

Manufacturer Part#:

16-81250-610C

Price: $ 6.59
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 16POS GOLD
More Detail: N/A
DataSheet: 16-81250-610C datasheet16-81250-610C Datasheet/PDF
Quantity: 1000
12 +: $ 5.99340
Stock 1000Can Ship Immediately
$ 6.59
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.140" (3.56mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 8
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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Sockets for ICs, transistors, and other types of components are rapidly becoming a common method for creating electronic devices. The technology behind these components is improving rapidly, and new applications are constantly being developed. The 16-81250-610C is an example of a socket designed specifically for ICs and transistors. This article will explore the application field and working principle of the 16-81250-610C.

The 16-81250-610C can be used in a variety of applications, such as amplifiers, power supplies, and communication circuits. These components typically require higher levels of accuracy and precision when it comes to performance. The 16-81250-610C is designed to meet this need. It is an integrated package containing the necessary components to allow for easier assembly, as well as improved performance.

At its core, the 16-81250-610C is a plastic package containing two rows of sockets. The package has been designed to fit into a specific footprint, often referred to as a “Q-Board” because of its shape. Each socket is connected to a 36-pin main connector that supplies power to the device. The sockets are wired to the same signal pins as the standard IC pinout, and can be quickly used with any IC. The sockets can also be used as ground connections if desired.

When power is applied to the main connector, the sockets are energized and the component can begin its operation. The current supplied to the sockets is regulated by the pins that receive the power. From these pins, the 16-81250-610C will generate a stable voltage and current that is needed for the components to operate. It also has a protective circuit that prevents overload and short circuits, protecting the components from damage.

The 16-81250-610C is also used in applications that require high speed data rates due to its fast data transfer rate. It is equipped with high-end technology that enables the processor to process and transfer data quickly. Due to its larger internal capacitance, it has relatively low power consumption, making it ideal for applications that require extended uptime.

The 16-81250-610C is designed to make installation faster and easier. It is pre-wired to simplify the process and also includes hardware that allows the sockets to be securely attached to the board. Furthermore, the package includes detailed instructions on how to install the sockets and the other components that are necessary for the device to function correctly.

The 16-81250-610C is a valuable tool when it comes to rapidly creating electronic circuits. Its design provides superior performance and reliability, making it well suited for complex circuit designs that require high levels of accuracy and precision. With proper installation and maintenance, it can provide years of reliable operation and help create advanced electronic devices.

The specific data is subject to PDF, and the above content is for reference

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