1703901033

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Backplane connectors provide a reliable connection between two or more boards in a rack or stack. They have an exposed contact surface that is designed for secure and efficient design of high-speed data communication buses. The 1703901033 backplane connectors are some of the most popular high-speed backplane connectors used in the industry today. In this article, we will look into the application field and working principle of the 1703901033.

Application Field

The 1703901033 backplane connectors are used in most electronic and communication systems, from edge-of-network to core-of-network applications. The versatility and design reliability of these backplane connectors make them ideal for a wide range of applications. These connectors are widely used in industrial automation, computers, consumer electronics, telecom and datacom, and automotive systems. They are also ideal for inductive sensing, measuring, and current passing applications.

Working Principle

The 1703901033 backplane connectors use the unique Contact-in-Card (CiC) technology that allows a signal to pass through the entire length of the card without being broken. The CiC technology provides superior electrical performance and body strength that is well-suited for high-speed, high-density applications. CiC technology also eliminates the need for crimping and soldering of the angled or vertical connections, and provides for superior durability during service life. The CiC technology enables the connection between the two boards to be more reliable and secure, ensuring the connection stays intact during data transfer.

The 1703901033 backplane connectors have a number of contact pins arranged in an array pattern on the bottom of the board. The pins are designed in a certain way to ensure optimal signal integrity over the entire card. The pins connect the board together at the exact right angle, allowing for low crosstalk, high signal level, and excellent timing values. These connectors also ensure a secure tight fit between the two boards, allowing for reliable data transfer without any signal degradation.

The 1703901033 backplane connectors are also designed with a low profile that allows them to fit perfectly in tight spaces. This makes them ideal for embedded systems and applications where there is limited space for components. They are also designed for high current handling capability and excellent thermal performance, making them suitable for applications that require high power handling.

In summary, the 1703901033 backplane connectors provide a reliable connection between two boards, ensuring secure transmission of data without any signal degradation. The CiC technology allows for low crosstalk, high signal level, and excellent timing values, while the low profile allows for easy connector installation in space-constrained applications. The 1703901033 also offers high current handling capability and excellent thermal performance for high power applications.

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