1761623-2 Allicdata Electronics

1761623-2 Connectors, Interconnects

Allicdata Part #:

1761623-2-ND

Manufacturer Part#:

1761623-2

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SKT FB-DIMM 240POS PCB
More Detail: 240 Position FB-DIMM DDR2 FBDRAM Socket Through Ho...
DataSheet: 1761623-2 datasheet1761623-2 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Style: FB-DIMM
Number of Positions: 240
Memory Type: DDR2 FBDRAM
Standards: MO-256
Mounting Type: Through Hole
Features: Board Guide, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Inline module sockets are an important component within a variety of systems, used to facilitate information transfer and connectivity with additional components. 1761623-2 is a type of inline module socket designed uncompromisingly for high-speed data applications. This inline module socket has become a popular choice for many types of applications.

1761623-2 module socket is one of the most advanced socket designs available. It offers a hybridized solution of unequalled performance and efficiency. It is newly designed and includes an advanced set of features with a wide range of benefits. The design boasts a high data speed, high reliability and a wide temperature range.

The 1761623-2 module socket is typically deployed in systems that require precise and consistent performance even in the harshest of conditions. The socket has a 2 mm pitch, five 4-finger gold-plated contacts, which is suitable for a wide variety of applications. It is also available in top-mount, side-mount, and bottom-mount configurations.

The 1761623-2 module socket is used for its reliable interconnections in high data rate applications. Examples of the most common applications include Wearable Electronics, Security Systems, Industrial Automation, Robotics, Automated Test Equipment, Medical Devices, and more. 1761623-2 module socket also features a device mounting which increases the strength of connections, even at high data rates.

Here is how this memory connector works: When mating, the wide-body contact areas hold the two connectors in position. This helps to ensure that the mating parts are precisely aligned before engagement. The four contact fingers, which are nominally 0.48mm high (typical variation 0.04mm) fit securely against the compliant ends of the pins on the opposite connector. As the male and female connectors mechanically interlock, their cut bands are designed to resist shock and vibration.

The 1761623-2 module socket is designed with an anti-angle-disconnection mechanism to ensure secure connection. The contacts are cleverly designed to withstand greater insertion forces. They are also suitable for proper insulation and heat dissipation, providing a stable current-bearing capacity.

The 1761623-2 module socket has a variety of features to ensure reliability and stability in extreme conditions. For example, its contacts are gold plated, can be insulated and have a temperature range of -40°C to +105°C. Its shrouded connection blocks can also be used with snap-in bases, further enhancing its versatility.

These features combined with its superior performance make this an excellent choice for high data rate applications. The 1761623-2 module socket is specifically designed for applications requiring start/stop, high speed data transfer, coding, and interconnecting components. It is versatile enough for use in a wide variety of industries and applications, making it well-suited for today’s modern requirements.

The specific data is subject to PDF, and the above content is for reference

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