18-811250-610C Allicdata Electronics
Allicdata Part #:

18-811250-610C-ND

Manufacturer Part#:

18-811250-610C

Price: $ 6.58
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 18POS GOLD
More Detail: N/A
DataSheet: 18-811250-610C datasheet18-811250-610C Datasheet/PDF
Quantity: 1000
10 +: $ 5.97933
Stock 1000Can Ship Immediately
$ 6.58
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.140" (3.56mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 8
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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Socket 18-811250-610C, known as a type of IC socket, is a replacement for use with integrated circuits, transistors, and other active devices. It is designed to provide a connection between an integrated circuit and the circuit board, which can enable them to interact efficiently and reliably. In addition, the socket also has the advantage of being low-cost and providing increased system reliability with less heat dissipation than is typical of traditional soldering.

The 18-811250-610C socket works by providing a physical interface between the integrated circuit and the board. It acts as an intermediary between them, providing an electrical connection and also acting as a barrier to the flow of heat. This allows the integrated circuit to be mounted on the board in a way that is fast, reliable, and cost-effective. It also allows the entire system to be designed more efficiently, as there is no need to solder the integrated circuit directly to the board.

The socket is also designed to provide maximum flexibility and compatibility with other components, which allows them to be used in different applications. It is constructed of a base made of plastic, which can be easily molded to suit the size and shape of the component it is intended for, and the integrated circuit is then attached to the socket body by a process known as \'piggybacking\'. The connection is made secure thanks to the locking mechanism. This locking mechanism is designed to ensure the contacts on the integrated circuit are secure and protected from any external damage or interference.

In terms of applications, the 18-811250-610C can be used in a range of applications. As with all IC sockets, it can be used to connect an integrated circuit to a circuit board, either directly or through a plug-in PCB. It can also be used in the design of circuit boards, as an intermediary component between the integrated circuit and the board. This can provide a single point of contact between the two, which can make it easier to make connections between the components.

In addition, the 18-811250-610C socket can also be used in the production of transistors. By using it in a transistor design, engineers and scientists can create transistors that are more reliable and efficient than if they were connected directly to the board. This socket can be used in a variety of transistor designs, including NPN or PNP, and can often provide a faster reaction time than connecting the transistor to the board directly.

The 18-811250-610C socket is an ideal choice for a range of applications, including integrated circuits, transistors, PC boards, and other components. Its low-cost and reliable design make it the perfect choice for both commercial and consumer applications. Its wide range of compatibility also ensures that it can be used in many different types of devices, allowing its use to extend to other areas of engineering and electronics.

The specific data is subject to PDF, and the above content is for reference

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