18-8670-310C Allicdata Electronics
Allicdata Part #:

18-8670-310C-ND

Manufacturer Part#:

18-8670-310C

Price: $ 6.45
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 18POS GOLD
More Detail: N/A
DataSheet: 18-8670-310C datasheet18-8670-310C Datasheet/PDF
Quantity: 1000
10 +: $ 5.86278
Stock 1000Can Ship Immediately
$ 6.45
Specifications
Series: 8
Packaging: Bulk 
Part Status: Active
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C
Termination Post Length: 0.140" (3.56mm)
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Contact Resistance: --
Description

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The 18-8670-310C is a socket used to connect integrated circuits (ICs), transistors, and other electronic components directly to a printed circuit board, enabling easy installation and removal of the devices. By enabling such an easy installation, the socket is designed to reduce production cost, as components are quickly installed and removed with minimal effort. The 18-8670-310C offers certain advantages, including compatibility with a wide variety of components; it is also designed to improve the chances of a good connection. This article will discuss the application field of the 18-8670-310C and its working principle.

Application Field

Sockets like the 18-8670-310C have a variety of applications, including prototyping, production, development, and repair. The sockets are extremely useful for prototyping, as they can be used to rapidly assemble different components onto a breadboard or printed circuit board. As the components can be quickly uninstalled, prototyping is simplified and the development process is expedited. The 18-8670-310C can also be used for production, as its design ensures that the components are quickly and securely installed. Such rapid installation reduces production costs and increases the efficiency of the production process. Additionally, the socket is also useful for repair purposes, as its design enables the easy removal and replacement of components.

Working Principle

The 18-8670-310C socket is designed to quickly and securely connect components such as ICs, transistors, and other electronic components to a printed circuit board. The socket is composed of multiple individual pins which are arranged in a grid pattern and connected to an integrated circuit mounted on the bottom side of the socket. The pins are arranged in a specific pattern which matches the arrangement of the IC pins, enabling the secure connection of the IC to the socket. The IC is secured in place by a mechanical latch on the upper side of the socket, which locks the IC into the socket. Additionally, the socket also features an insulation base which protects the components from dust and other foreign objects. In order to ensure reliable connections, the socket is designed to minimize contact resistance and to reduce the chance of faulty connections.

Conclusion

The 18-8670-310C is a socket used to quickly and securely connect integrated circuits, transistors, and other electronic components to a printed circuit board. It is designed to improve the efficiency of the installation process, thereby reducing production costs and improving productivity. Furthermore, the socket’s design ensures reliable connections, thereby increasing the chances of obtaining a good connection between the IC and the socket. The socket is applicable for prototyping, production, and repair work, and is an invaluable tool for any work involving the installation of ICs and other electronic components.

The specific data is subject to PDF, and the above content is for reference

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