1801178-1

Application field and Working Principle

1801178-1 rectangular housings are compact with high density connections for 1.25 mm pitch dense wire-to-board applications. These housings accommodate up to 12 circuits for a wide variety of applications, including consumer appliances, office equipment, medical diagnostic and imaging equipment, and instrumentation.

The operating temperatures of 1801178-1 housing is from -25°C to +85°C. These 1.25 mm pitch board-to-board and wire-to-board interconnect solutions offer an optimal combination of signal integrity, power, and durability.

1801178-1 housings are composed of plastic, and have low resistance contact lower resistance than common housings. The combination of its seat and arc combination, the deadlock structure, and the bevel frame can effectively Resist vibration, withstand a pulling force of up 9.8N, and ensure electrical stability.