1825108-1 Allicdata Electronics
Allicdata Part #:

A35061-ND

Manufacturer Part#:

1825108-1

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 24POS GOLD
More Detail: N/A
DataSheet: 1825108-1 datasheet1825108-1 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: 30 mOhm
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.128" (3.24mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Thermoplastic, Glass Filled
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: Diplomate DL
Mounting Type: Through Hole
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 24 (2 x 12)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Obsolete
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, transistors, and other electronic components are becoming increasingly popular due to their ability to connect a wide variety of components and devices. The 1825108-1 socket is no exception, and is becoming an ever more common item in many hardware projects. This article will discuss the application field and working principle of the 1825108-1 socket, as well as how it is used in general electronics applications.

Application Field

The 1825108-1 socket is designed for electrical and electronic components needing sixteen through-hole connections. This makes the socket suitable for mounting integrated circuits, transistors, and other components with comparable pin sizes. The socket is also used in many consumer electronics products and computer applications as a means of connecting easily and seamlessly through the application of solderless assembly techniques.

Working Principle

The 1825108-1 socket works by attaching a flexible strip of metal contacts to a base, which forms sixteen through-hole connections. The contacts fit into the peripheral holes of an integrated circuit, transistor, or similar device, providing electrical connections between the component and the socket\'s base. Between the contacts and the base, a resilient foam or rubber material is used to ensure secure insulation from outside elements. This foam or rubber is also designed to absorb mechanical stresses, and therefore protect the device against shock or vibration.

Uses in General Electronics Applications

The 1825108-1 socket is often selected as an efficient and secure method of mounting a wide range of electronic components, particularly for solesless assembly. It is often used in industrial projects, where it is necessary to quickly create connections between components in small spaces. The socket\'s through-holes provide a secure and quick connection to each of the device pins, making it suitable for items such as transistors, amplifiers, and other components which require a plug-and-play style connection.

In addition, the socket\'s insulation provides reliable protection against corrosion or physical damage, which can be an issue in a variety of industrial settings. This makes it a desirable choice for many electronic assemblies, and can play an important role in protecting against short circuits which can be costly to repair or replace.

Conclusion

The 1825108-1 socket is a reliable and low-cost solution for mounting a variety of components, which includes transistors, integrated circuits, and similar devices. It provides sixteen through-hole connections, as well as an insulation layer, to ensure that the connection is secure and reliable. The socket is often used in a wide variety of industries and consumer electronics applications, and is a viable option for solderless assembly to quickly and securely mount electronic components.

The specific data is subject to PDF, and the above content is for reference

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