1825532-1

Features:	Closed Frame
Contact Resistance:	--
Material Flammability Rating:	UL94 V-0
Termination Post Length:	--
Operating Temperature:	--
Housing Material:	Thermoplastic, Polyester
Contact Material - Post:	Copper
Contact Finish Thickness - Post:	180.0µin (4.57µm)
Contact Finish - Post:	Tin
Pitch - Post:	0.100" (2.54mm)
Termination:	Solder
Series:	510
Mounting Type:	Through Hole
Contact Material - Mating:	Beryllium Copper
Contact Finish Thickness - Mating:	Flash
Contact Finish - Mating:	Gold
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	16 (1 x 16)
Type:	SIP
Part Status:	Obsolete
Packaging:	--

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:Sockets for ICs, Transistors:

In recent times, there has been an increased demand for small electronic components and circuitry. The development of the Internet, with its wide range of applications, has further aided the development of small and efficient electronics. However, due to the miniaturization of these components, some crucial functionality can be lost. To overcome this issue, 1825532-1 application field and working principle was designed to enable the connection and communication of small components and micro-electronics.1825532-1 are comprised of a series of small interconnected pins. These pins are typically found in a 20-pin or 28-pin configuration on the baseboard of a device. The pins are connected to multiple memory channels such that data can be transferred from one component to another.The pins are electrically powered so as to drive the various signal paths. This creates a power connection between the two components. This electrical connection means that the two components do not need to be physically connected.In operation, 1825532-1 application field and working principle is responsible for both transmitting and receiving data between the various components. The electrical power connections work to ensure that the signal is not affected while transmitting or receiving.In addition, 1825532-1 can be used to connect multiple components at once. This reduces the need for multiple cables and thereby helps keep the device organized. Furthermore, the signal paths can be connected to multiple components without needing to physically connect the components. As a result, the overall system design is simplified and the circuit components are able to be connected without any additional physical components.The 1825532-1 also provides a higher level of protection for the electronic components. This is achieved through an additional shielding layer which is used to protect the components from electrical interference. This helps to keep the components functioning without any hiccups.Finally, 1825532-1 is able to provide a higher level of electrical performance and reliability when compared to other traditional connection methods. Each connection is designed to be robust and able to withstand a wide range of electrical signals and temperatures. This ensures that the components are able to withstand long-term use.In conclusion, 1825532-1 application field and working principle are an integral part of modern small electronic devices. The ability to connect multiple components without needing to physically connect them helps to improve both overall system design and electrical performance. Furthermore, the additional layer of protection provided by the additional shielding ensures that the components perform optimally without any issues.

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