188667-9 Allicdata Electronics

188667-9 Connectors, Interconnects

Allicdata Part #:

188667-9-ND

Manufacturer Part#:

188667-9

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN HEADER 62POS Z-PACK PCB
More Detail: 125 Position Header, Male Pins Connector 0.079" (2...
DataSheet: 188667-9 datasheet188667-9 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Z-PACK
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Type: Header, Male Pins
Connector Style: B 25
Number of Positions: 125
Number of Positions Loaded: 62
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Mounting Type: Through Hole
Termination: Press-Fit
Connector Usage: Backplane
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Current Rating: 1.5A
Voltage Rating: 500Vrms
Operating Temperature: -55°C ~ 125°C
Features: --
Description

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Backplane connectors are electronic components used to connect printed circuit boards together in a backplane configuration. The 188667-9 is a rugged, low-profile backplane connector developed to make the connection between heavy equipment and backplanes that require ruggedness and high performance. It is one of a family of hard metric connectors that are specifically designed to meet harsh environment requirements.

The 188667-9 was developed to serve as an alternative to the classic hard metric standard. The 188667-9 is a high-performance backplane and contacts are made of high-temperature, high-current conductors for a reliable electrical connection. The 188667-9 is a hard metric standard connector, which allows for an easy connection within other connectors that are ISO compliant. The connector has a board mounting footprint of 121mm x 25.4mm, designed for standard board-to-board configuration.

The 188667-9 is ideal for high-performance applications, such as ruggedized communications and ASICs. The high-bandwidth connector ensures that data transfers take place in a consistent and reliable way. Due to its small size, the connector also provides excellent backside accessibility, which is important in order to reduce system cost and provide flexibility.

The 188667-9 connector has a wide range of features that make it suitable for a number of different applications. It features a high contact density, with over 300 pins on each row. The connector has universal, high-retention crimp contacts, a solid TPA (Thermal Plastic alloy) latch, and screened/shielded cable assemblies. It also features a patented dual-row framework, which is designed to reduce stress on the connectors, and conforming shields for optimal signal integrity.

In terms of installation, the 188667-9 connector is easy to install, with an IDC termination system, and spring-loaded contact inserts. The connector is also designed with an IP68 protection rating, meaning it is suitable for extended duration use in harsh conditions. The connector is also designed to ensure a low level of insertion force, to reduce the risk of damaging contacts upon insertion.

In terms of performance, the 188667-9 is designed to provide a high level of signal integrity. The connector is designed with polymer insulation that helps to reduce RF bias and ensures interference-free data transmission. The contacts of the 188667-9 are also designed with gold plating which provides a reliable and corrosion-resistant connection.

The 188667-9 is a high-performance, low-profile connector used for backplane systems. It is designed to provide reliability in harsh environments and high-bandwidth performance. Its features include a universal, high-retention crimp contacts, a solid TPA latch, screened/shielded cable assemblies and a patented dual-row framework. Despite its small size, the 188667-9 is a reliable connector that is ideal for high-performance applications that require high-bandwidth and signal integrity.

The specific data is subject to PDF, and the above content is for reference

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