1926189-2

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Backplane connectors are an important element of circuit boards in electronics. In recent years, with the development of high-speed microprocessors, memory and peripheral devices, there is a need for better interconnects between these devices. The backplane connector 1926189-2 is a specialized backplane connector. It is designed to meet the requirements of modern circuit boards.

The 1926189-2 is a mixed pitch, high density backplane connector system. It is designed to provide high performance, maximum speed data transmission, and improved signal integrity.The connector includes multiple rows of connectors and receptacles to enable connection with multiple devices. The rows have different row lengths and pitches to create high density connections. The contacts are made with gold and nickel plated contacts.

The backplane connector has an array of different applications. It is used to connect different modules and components on a single board, to mount printed circuit boards (PCB) on a frame, and to connect motherboards to daughter boards. It is used in a wide range of industries including communications, aerospace, computing, automotive, and medical technology.

The 1926189-2 backplane connectors are designed for high speed, low latency data transmission. It has an impedance-matched structure that minimizes signal cross-talk and reflections, resulting in improved signal integrity. It can transmit data at speeds up to 15 GHz, depending on the application. For example, it is capable of transmitting data at up to 8.5 Gbps for Ethernet applications.

The working principle of the 1926189-2 backplane connector is as follows. The contact pins on the connector are inserted into the receptacle on the mating device. The connection is then established and data can be transmitted between the two devices. The connector also features a locking mechanism to ensure a secure connection.

The 1926189-2 backplane connector is a specialized connector designed to meet the needs of modern circuit boards. It has a high density, mixed-pitch design that enables high speed data transmission with improved signal integrity. It is used in a wide range of applications in communications, aerospace, computing, automotive, and medical technology.

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