2-1571550-9 Allicdata Electronics
Allicdata Part #:

2-1571550-9-ND

Manufacturer Part#:

2-1571550-9

Price: $ 5.76
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 28POS GOLD
More Detail: N/A
DataSheet: 2-1571550-9 datasheet2-1571550-9 Datasheet/PDF
Quantity: 7
1 +: $ 5.23530
10 +: $ 5.00850
25 +: $ 4.55339
50 +: $ 4.32571
100 +: $ 4.21180
250 +: $ 3.75649
500 +: $ 3.52883
1000 +: $ 3.11903
Stock 7Can Ship Immediately
$ 5.76
Specifications
Features: Closed Frame
Contact Resistance: 10 mOhm
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: 500
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Sockets for ICs, Transistors

The 2-1571550-9 application field and working principle are a necessary component for any small-sized integrated circuit board, such as those found in electrical and electronic devices. The 2-1571550-9 works as a removable socket replicator, designed to provide a secure connection between a device circuit board and an integrated circuit device. It is also capable of providing an interface between signal and power connections, making it possible to bridge older and newer IC technologies.

The primary purpose of this socket is to facilitate the integration of an IC into any electrical or electronic circuit. The socket provides a reliable connection for power and signal channels between the IC and the circuit board, and also provides a stable connection in the event of shock or vibration. This helps to ensure a reliable connection of the device, reducing errors due to faulty links. Furthermore, the 2-1571550-9 can also be used to bridge two different technologies, such as between two different IC products, allowing for more flexibility in circuit board architectures.

The socket works using a metal contact system which contains the pins for connecting to the IC or other electrical components. The pins are fitted to the socket using heat pipes, which serve to monitor the power and signal levels passing from the IC to the circuit board. The heat pipes also ensure a secure and reliable connection between the two components, and can be adjusted in size and shape to suit any size or layout of IC.

The socket also contains gold contacts which serve to complete a reliable electrical connection between the IC and the circuit board. The gold contacts conduct electrical current through the pins and the socket’s metal contact system, completing a reliable and secure connection between the two components. This process also helps to reduce interference and noise between the electrical components, ensuring a more stable electrical connection.

In addition, the 2-1571550-9 socket also features a safety latch to prevent accidental disconnection of the socket from the circuit board. This latch is activated when the IC is first inserted, and then disabled when the IC is unlocked and removed. This gives added protection from the accidental or premature separation of the IC from the circuit board.

The 2-1571550-9 application field and working principle are important components for the integration of an integrated circuit into any electrical or electronic system. This socket helps to not only ensure reliable connections between the IC and the circuit board, but also helps to reduce interference and noise between the components. Furthermore, the socket also features a safety latch to ensure that the IC is not accidently separated from the circuit board, providing an additional layer of protection and reliability.

The specific data is subject to PDF, and the above content is for reference

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