
Allicdata Part #: | 2-1734053-2-ND |
Manufacturer Part#: |
2-1734053-2 |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | CONN SKT 240POS DDR II |
More Detail: | 240 Position Socket |
DataSheet: | ![]() |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | 0.00000 |
Series: | -- |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Obsolete |
Moisture Sensitivity Level (MSL): | -- |
Connector Style: | -- |
Number of Positions: | 240 |
Memory Type: | -- |
Standards: | -- |
Mounting Type: | -- |
Features: | -- |
Mounting Feature: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 15.0µin (0.38µm) |
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Memory connectors come in many shapes and sizes, ranging from simple pins to elaborate circuits and connectors. Inline Module Sockets are a type of memory connectors that offer superior performance, flexibility, and reliability for users. They are used in a variety of applications, such as memory cards, memory modules, and systems that require memory expansion.
The Inline Module Socket is composed of two parts, a module and a base. The module connects directly to the main board and the base is designed for mounting the various type of memory modules. The module contains the female socket, which is designed for attaching the memory module pins to the main board. It also has a base that contains the male connector pins, which are inserted into the module socket.
Inline Module Sockets are designed to offer a high-speed interface between the main board and the memory module. The dual-sided contacts provide robust electrical connections and low contact resistance, which helps to reduce the jitter and reduce power consumption. The high-density contacts also allow manufacturers to use a variety of memory modules with different speeds and capacities. In addition, the connectors are designed to meet EIA/TIA-99 and MIL-C-28588 specifications, ensuring excellent reliability and compatibility.
Inline Module Sockets also offer several different communication protocols. These include Serial Digital signaling, Serial Low Speed, and Random Access Memory bus. Serial Digital Signaling (SDSP) is used to transfer very large amounts of data between two devices, while Serial Low Speed (SLSP) is used for low speed data transfer between two systems. Finally, the Random Access Memory bus is a high speed communication bus used to transfer large amounts of data between memory devices.
The working principle of the Inline Module Socket is simple. Power is delivered to the socket and the power is then supplied to the memory module. The module is then configured with the necessary settings specific to the application. Once the configuration is complete, the memory module is able to access and manipulate data stored within its memory. The module also receives signals and data from the main board, allowing the user to make changes or execute commands.
The inline module socket is used in a variety of applications. These include consumer electronics, automotive systems, aerospace systems, communications systems, and embedded systems. It is also used in more specialized systems, such as gaming consoles, medical systems, and industrial systems. In addition, the Inline Module Socket has also found its way into computer server systems, where it is used as an adapter to support memory expansion.
Inline Module Sockets offer superior performance, flexibility, and reliability for memory-based applications. Its high-speed interface ensures high transmission rates while its dual-sided contacts offer reliable electrical connections and low contact resistance. This helps to reduce power consumption and jitter. Additionally, its high-density contacts allow a variety of memory modules to be used and its compatibility with various communication protocols provides flexibility for data transfer. All these features combined make the Inline Module Socket an ideal choice for memory expansion applications.
The specific data is subject to PDF, and the above content is for reference
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