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Memory Connectors - Inline Module Sockets

2-2013022-1 Application Field and Working Principle

The 2-2013022-1 is a type of memory connector, specifically an inline module socket. It is used for memory connectivity, primarily in memory controller applications. This particular module socket has a variety of features which make it ideal for certain types of memory modules.

The 2-2013022-1 memory connector operates with two primary principles. The first approach is load leveling. This is a process which allows data transmissions to take place while maintaining a constant voltage to the memory modules. Therefore, the module does not suffer from current surge damage, as it will not be exposed to excessive voltage levels during the operation. The second principle is self-synchronization. This feature works by continuously monitoring the data transmission process and regulating the data transmission rate accordingly. This ensures that the data transmission process is always optimized for maximum performance.

The 2-2013022-1 module socket is primarily designed for use in embedded memory controller applications. It has a host-interface-side interface, which is a serial data interface normally used for communicating with the memory module. A host-interface-side power supply is also included in the package, allowing the memory device to be powered through the module. This eliminates the need for a dedicated power supply.

The module socket also has several optional features, which may make it more suitable for certain applications. These include a signal buffer, allowing the memory module to communicate at faster speeds, as well as a power control circuit, which can be used to regulate the current flowing to the memory module.

The 2-2013022-1 memory connector boasts a variety of features which make it ideal for certain embedded memory controller applications. Its main features are its load leveling, self-synchronization, signal buffer and power control capabilities. Together, these features allow the connector to be used for a variety of memory connectivity applications.

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