2-2013266-1 Allicdata Electronics
Allicdata Part #:

A117480-ND

Manufacturer Part#:

2-2013266-1

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SKT DIMM 240POS PCB
More Detail: 240 Position DIMM DDR3 SDRAM Socket Through Hole
DataSheet: 2-2013266-1 datasheet2-2013266-1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Not applicable / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Style: DIMM
Number of Positions: 240
Memory Type: DDR3 SDRAM
Standards: MO-269
Mounting Type: Through Hole
Features: Board Guide, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Inline module sockets are a type of memory connector that offers many advantages over traditional memory connectors such as increased flexibility and scalability, enhanced high-speed communication capabilities, and better support for multiple technologies. An inline module socket is typically inserted into a backplane or system board to provide a direct connection between components in the system. Inline module sockets are commonly used in servers, switches, telecom systems, and other high-performance systems.

The working principle of an inline module socket is based on a number of principles, including physical, thermal, electrical, optical, and material science. The physical principles refer to the physical design of the socket, including its shape, size, and material composition. The thermal principles refer to heat dissipation, which is a critical component when it comes to maintaining optimal heat dissipation and operation. Electrical principles include current and voltage measurements, with the voltage and current being adjusted based on the requirements of the application.

The optical principles refer to the ability of the inline module socket to send and receive data across a distance, allowing for high-speed connections between components. Finally, material science principles apply to the design of the socket, including its overall integrity and its compatibility with the contacts and cables that are used to create the connection. All of these principles work together to ensure the reliability and performance of the inline module socket.

Inline module sockets can be used in a variety of applications, ranging from industrial PCs and network switches, to embedded systems and memory systems. In industrial PCs, the inline module sockets are used to connect processor boards to the backplane, allowing for increased flexibility and scalability. In network switches, they are used to connect multiple devices with the switch for better control and management of traffic. In embedded systems, the inline module sockets are used to connect the processor and I/O boards, providing increased communication capabilities.

In memory systems, the inline module sockets are used to provide direct-to-chip communication. This allows for faster data transfer than using traditional memory connectors, and it also allows data transfer to occur without additional connections. This makes it ideal for high performance computing and storage applications. Finally, inline module sockets can be used in telecom systems, allowing for easier installation and management of connection components.

Inline module sockets offer many advantages over traditional memory connectors. With their increased performance capabilities, scalability, and flexibility, they are an ideal solution for many applications. Their physical, thermal, electrical, optical, and material science principles allow them to offer reliable, efficient communication across multiple technologies and applications.

The specific data is subject to PDF, and the above content is for reference

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