2-382462-1 Allicdata Electronics
Allicdata Part #:

2-382462-1-ND

Manufacturer Part#:

2-382462-1

Price: $ 0.20
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 8POS TIN
More Detail: N/A
DataSheet: 2-382462-1 datasheet2-382462-1 Datasheet/PDF
Quantity: 1000
5200 +: $ 0.17903
Stock 1000Can Ship Immediately
$ 0.2
Specifications
Features: Closed Frame
Contact Resistance: 30 mOhm
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.128" (3.24mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Thermoplastic
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: Diplomate DL
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: --
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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2-382462-1 Sockets for ICs, Transistors are devices utilized to physically interface electrical signals, primarily between semiconductor devices and printed circuit boards (PCBs). They are often deployed for prototyping, design validation, and production applications. 2-382462-1, as a series of Sockets for ICs, Transistors, are commonly utilized for the application and integration of medium to large scale integrated circuits (IC) and RF(Radio Frequency) devices. Different from other sockets in the same series, 2-382462-1 has the following features:

Application Field

  • 2-382462-1 is applied for testing and mating of ICs, transistors and other electronic devices.
  • 2-382462-1 application field covers signal and power module, digital IC, linear IC and RF module.
  • 2-382462-1 is also suitable for use in test line, development of electrical products and data synchronous and communication.

Working Principle

The working principle of 2-382462-1 sockets is based on its particular pin-out structure and contact resistance. The pin array of 2-382462-1 is made of small springs that allow the pins to be securely pushed and pulled into and out of the sockets. When a device is inserted into a socket, the pins will contact the corresponding pins of the device and form a reliable connection. Therefore, 2-382462-1 can be widely used to exchange electronic signals, and even enable high-speed transmission of data.

Advantages

2-382462-1 sockets offer the following advantages compared with other IC and transistor sockets:
  • 2-382462-1 has a compact size and can be easily embedded into PCBs for the integration of components.
  • The high contact forces of 2-382462-1 sockets ensure reliable connection and reduce contact resistance.
  • 2-382462-1 sockets has excellent thermal and electrical characteristics, providing excellent signal transmission performance and better circuit reliability.
  • 2-382462-1 sockets have reliable protection against EMI(Electromagnetic Interference), ESD(Electrostatic Discharge), and lightning.
  • 2-382462-1 sockets can effectively reduce signal crosstalk between pins.

Applications

2-382462-1 sockets can be used for testing and mating of a variety of signals and power modules, digital IC, linear IC, and RF module. 2-382462-1 can also be applied in the test line, development of electrical products, as well as data synchronous and communication. 2-382462-1 has a wide range of applications in automotive, consumer electronics, communications, and industrial control.

Conclusion

2-382462-1 sockets are applied widely for testing and mating of different kinds of ICs, transistors, and other electronic devices. 2-382462-1 has a compact size, excellent contact forces, and high performance for signal transmission and circuit reliability. The various advantages of 2-382462-1 make it an ideal choice for a variety of applications, such as automotive, consumer electronics, communications, and industrial control.

The specific data is subject to PDF, and the above content is for reference

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