2-382462-3 Datasheet/PDFSockets for ICs, Transistors
2-382462-3 Application Field and Working Principle
The 2-382462-3 socket is designed to be used as an integrated circuit (IC) package and transistor socket in electronic components. It utilizes resonant microstrip transmission line technology to deliver optimal signal integrity and is suitable for use in applications requiring high signal consistency while operating in an environment where cost and space are at a premium. This type of socket provides an excellent choice when dealing with multiple signal paths, as it can accommodate both ICs and transistors, meaning it can support a range of functions. Additionally, this socket is also designed to provide reliable and highly efficient performance.
2-382462-3 socket\'s application range is varied and it can be used for a wide variety of electronic components. This includes but is not limited to: transistor arrays, IC packages, sensors, and power supplies. One of its key advantages is that it can manage the demanding requirements of high-frequency, high-speed applications. This makes it an ideal choice for embedded systems, as well as for gain stages in audio systems.
When it comes to its working principle, the 2-382462-3 socket utilizes resonant microstrip transmission line technology. This technology acts as a passive filter and is designed to ensure perfect signal performance and low insertion loss. It operates at frequencies up to 10 GHz and is very effective at removing unwanted noise, making it highly reliable for precision applications. It also works to reduce the undesirable power dissipation found in electromechanical contacts by eliminating direct connections to ground. This helps to prevent interference and crosstalk.
Furthermore, since the 2-382462-3 socket is designed to offer reliable performance, it also works to protect against long-term damage caused by heat. It has a higher failure threshold than traditional socket types, making it suitable for applications where the temperatures may reach higher levels than those seen in some conventional packages. Additionally, as mentioned previously, its small size and low profile make it suitable for use in space and cost-constrained environments.