20-1508-31 Allicdata Electronics
Allicdata Part #:

20-1508-31-ND

Manufacturer Part#:

20-1508-31

Price: $ 8.78
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 20POS GOLD
More Detail: N/A
DataSheet: 20-1508-31 datasheet20-1508-31 Datasheet/PDF
Quantity: 1000
8 +: $ 7.97580
Stock 1000Can Ship Immediately
$ 8.78
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.500" (12.70mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polyamide (PA46), Nylon 4/6
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 508
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.2" (5.08mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors

Integrated circuits (ICs) and transistors are typical components used in modern electronics. Most ICs and transistors are installed in sockets, such as dual in-line packages (DIPs), plastic leaded chip carriers (PLCCs) or plastic dual-in-line packages (PDIPs), in order to facilitate maintenance and serviceability. Socketing also reduces replacement costs and saves time; it eliminates the need to solder and desolder components by hand. Moreover, socketing makes it possible to replace the integrated circuits and transistors and to test them in the sockets without having to physically desolder them.

The working principle of ICs and transistor sockets is based on the electrical and mechanical connections between the component and the base. The connection between the IC (or transistor) and the socket commonly use either soldering or elastomeric cable connection. For soldering, a soldered connection can be made using a type of solder that will form a reliable electrical connection when in contact with the integrated circuit leads. Elastomeric cables are commonly used in connecting the IC to the socket, due to their lower cost and ability to withstand higher temperatures than standard cables.

There are several types of IC and transistor sockets available on the market, but the most commonly used types are those with spring arms, pin grids, and lead frames. Spring arm sockets are designed with two spring-loaded arms that connect the IC and the socket. Pin grid sockets are made of metal pins arranged in rows and columns, making it possible to accommodate different sizes and shapes of ICs and transistors. Leadframe sockets are constructed of nickel-plated contacts which are fixed firmly in place in a plastic frame. This type is most suitable for large ceramic packages or lead-third packages.

Sockets for ICs and transistors are also available in either surface mount or through-hole packages. Surface mount packages are designed to allow ICs and transistors to be mounted on a printed circuit board (PCB) without the need for soldering. Through-hole packages require soldering but are more rugged and less prone to damage than surface mount packages.

When selecting sockets for ICs and transistors, it is important to consider the type of device being used, the type of connection required (soldered or elastomeric cable), the size and shape of the package, and the temperature range of the application. By understanding the characteristics of the components and the requirements of the application, it is easier to select a socket which meets the application’s needs.

The specific data is subject to PDF, and the above content is for reference

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