20-3508-311

Sockets for ICs, transistors, and other components have become an integral part of electronic assembly processes. The 20-3508-311 application field and working principle expands upon the capabilities of traditional sockets, allowing them to be used in a range of applications. This article will provide an overview of the 20-3508-311, its features, and the principle on which it operates.

Overview of the 20-3508-311 socket

The 20-3508-311 socket is a specialized connection device that is designed to connect a variety of components to each other without manual assembly. This device is designed to have sufficient space for an array of hybrid components and provides isolation between them, protecting components from any internal effects due to its environment. It also features a low-profile construction that reduces its total footprint.

Features

The 20-3508-311 socket features several key characteristics that make it ideal for many applications. Firstly, it features an external contact grid that allows for direct soldering and a wire leaded connection that helps to simplify circuit board assembly. Furthermore, the socket utilizes a low-profile design, with an overall height of just 8.4 mm, allowing it to be placed in tight configurations. Additionally, the flat-tethered contacts allow for easy electrical termination. The socket also allows for packaging of components in opposing directions, enabling its use for dual-sided applications.

Working Principle

The 20-3508-311 socket operates on the principle of thermal-heat conduction. This principle involves the transfer of heat between two objects that are held in direct contact. This type of contact enables the two objects to be connected without the need for external electric connections. The heat generated by the contact creates a small current, which is then sent through the circuit. This current causes the components to be connected and maintains a strong connection. Additionally, the principle of thermal-heat conduction offers a secure, reliable connection that is resistant to mechanical shocks and vibration.

Conclusion

The 20-3508-311 application field and working principle demonstrates the versatility of sockets for ICs, transistors, and other components. It enables the connection of multiple components using a low-profile design and enables components to be packaged in opposing directions. Furthermore, the socket uses the principle of thermal-heat conduction for secure, reliable connections, and helps to simplify circuit board assembly. This makes the 20-3508-311 socket an ideal choice for applications requiring high-quality, reliable connections.