20-3518-111 Allicdata Electronics
Allicdata Part #:

20-3518-111-ND

Manufacturer Part#:

20-3518-111

Price: $ 3.93
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 20POS GOLD
More Detail: N/A
DataSheet: 20-3518-111 datasheet20-3518-111 Datasheet/PDF
Quantity: 1000
22 +: $ 3.56838
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 518
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 20-3518-111 socket, also known as the Virtual Architecture socket, is an integrated Circuit (IC) and transistor socket designed to address the fast-paced environment of integrated circuits. The socket is designed to accommodate a wide range of IC and transistor sizes and types, making it a useful solution for a variety of applications. Its advanced design provides adaptability, durability, and reliability that are necessary for any IC and transistor socket.

The 20-3518-111 socket is primarily used in applications in which high-performance data transfers are needed, such as in computers, telecommunications, test and measurement equipment, and other digital designs. It is also often used in the automotive and medical industries. As most ICs and transistors are used in some form of electronic circuitry, the 20-3518-111 socket is also suitable for all applications that involve designing and assembling electronic circuits, such as control systems, embedded systems, and circuit boards.

The 20-3518-111 socket is designed to provide a secure connection between the IC and the socket. It features a combination of both horizontal and vertical pin connections, which provide better contact compatibility and a secure connection. The socket is also designed to accept a wide range of IC lead shapes and sizes, including QFN, SOIC, PDIP, and Flip-chip. Furthermore, the socket is designed with a low insertion force, which makes assembly easy and efficient.

The 20-3518-111 socket also features a vibration-resistant design that ensures the secure connection between the IC and the socket will remain intact throughout the life of the system. The socket is also designed with a low-profile design, which allows for the ICs and transistors to be used in tight spaces. Moreover, the socket also includes a circuit grounding plate which prevents electrostatic discharge (ESD) from damaging the IC.

The 20-3518-111 socket is highly reliable and offers excellent thermal performance. The socket has a high temperature rating, which helps to keep the ICs and transistors safe during higher temperature operation. The socket also includes a feature called “cold solder protection,” which prevents soldering or heat-related damage to the ICs by dissipating heat away from the ICs. Moreover, the socket design also reduces micro-arcing and reduces the likelihood of soldering or heat-related damage to the ICs.

The 20-3518-111 socket provides adaptable and reliable electrical connections for a variety of applications. Its superior design offers increased protection from vibration and electrostatic discharge, as well as improved thermal performance. In addition, its low-profile design makes it ideal for tight-space applications. With its combination of features, the 20-3518-111 socket is an ideal solution for a variety of integrated circuit and transistor applications.

The specific data is subject to PDF, and the above content is for reference

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