20-3518-112 Allicdata Electronics
Allicdata Part #:

20-3518-112-ND

Manufacturer Part#:

20-3518-112

Price: $ 4.10
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 20POS GOLD
More Detail: N/A
DataSheet: 20-3518-112 datasheet20-3518-112 Datasheet/PDF
Quantity: 1000
19 +: $ 3.72827
Stock 1000Can Ship Immediately
$ 4.1
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 518
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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The 20-3518-112 socket is a member of a growing family of sockets for ICs, transistors, and other forms of integrated circuitry. It is designed to connect and disconnect an integrated circuit (IC) from its power supply, signal, and ground leads in order to facilitate the testing and evaluation of the IC. The socket is currently being used in a variety of applications requiring the quick and safe interconnection of ICs and other IC-like components.

Features and Benefits

The 20-3518-112 socket offers the following features and benefits:

  • Wide operating temperature range up to 200°C.
  • Wide electrical band gap (EG) range.
  • Low contact resistance.
  • Low thermal resistance.
  • Robust and reliable performance with low power consumption.
  • Compatibility with a wide range of ICs and other IC-like components.
  • Compact size.
  • High current carrying capability.
  • Enhanced signal integrity.
  • Easy and secure plug-in installation.

Application Field and Working Principle

The 20-3518-112 socket is ideal for applications in a wide range of industries, including consumer electronics, automotive, aerospace, and telecom. It can be used for high-speed testing and evaluation of devices such as CPUs, FPGAs, GPUs, RAMs, ROMs, Logic ICs, RF ICs, and MEMS components. The 20-3518-112 socket works by providing the interconnections between the IC, power supply, signal, and ground leads of the device being tested. The socket has a pin-grid array (PGA) configuration, which allows for easy connection and disconnection of the IC from the Power, Signal, and Ground leads when needed.

When the integrated circuit is inserted into the socket, the electrical connection is made between the IC and the Power, Signal, and Ground leads. This connection can be made either directly or by means of a shielded socket, depending on the type of application. The 20-3518-112 socket then provides the electrical isolation needed for testing and evaluation. This electrical isolation ensures the integrity of the signal paths and reduces the risk of damage to the IC or other circuitry during the testing procedure.

The 20-3518-112 socket is designed to withstand high temperatures and rugged environments, making it suitable for use in a wide range of applications. Its low power consumption and high current-carrying capability allow for efficient testing and evaluation processes. The 20-3518-112 socket is also designed to be compatible with a variety of ICs and other IC-like components, making it suitable for use in a wide range of testing and evaluation scenarios.

Conclusion

The 20-3518-112 socket is a reliable tool for testing and evaluation of ICs and other IC-like components. Its wide operating temperature range and wide EG range make it suitable for demanding testing and evaluation requirements. Its low contact resistance and low thermal resistance ensure high signal integrity and reduced power consumption. The 20-3518-112 socket is also designed to be compatible with a wide range of ICs and other IC-like components, making it a versatile tool for a variety of testing and evaluation scenarios.

The specific data is subject to PDF, and the above content is for reference

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