20-71070-10 Allicdata Electronics
Allicdata Part #:

20-71070-10-ND

Manufacturer Part#:

20-71070-10

Price: $ 6.54
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET SIP 20POS TIN
More Detail: N/A
DataSheet: 20-71070-10 datasheet20-71070-10 Datasheet/PDF
Quantity: 1000
10 +: $ 5.94405
Stock 1000Can Ship Immediately
$ 6.54
Specifications
Series: 700 Elevator Strip-Line™
Packaging: Bulk 
Part Status: Active
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C
Termination Post Length: 0.150" (3.81mm)
Material Flammability Rating: UL94 V-0
Current Rating: 1.5A
Contact Resistance: --
Description

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Sockets for ICs, transistors, and other electronic components are now commonplace and used in virtually all types of electronics. The 20-71070-10 application field and working principle of these sockets were designed to deliver strong reliable connections and reduce the age and threat of component damage due to poor soldering techniques or overheating. This article will discuss what the 20-71070-10 is, the application fields it is used in, and its working principle.

The 20-71070-10 is an advanced dual-socket for ICs and transistors. It consists of two 25-pin sockets that are mounted on a triangular frame, with 20 pins in a row and 10 pins in a column. This configuration provides a compact form factor that can easily fit within almost any circuit. The sockets provide reliable contacts for the IC or transistor leads, and are designed to withstand high levels of stress and force.

The 20-71070-10 application fields are varied and widespread. It is commonly used to connect ICs, transistors, and other electronic components in consumer electronics, medical devices, industrial applications, automotive systems and computers. It is also ideal for prototyping and low-volume production assemblies. The 20-71070-10 is particularly beneficial when used in supporting high speed and high signal density designs, as it can help limit electromagnetic interference and reduce board area.

The working principle of the 20-71070-10 is based on the concept of making secure electrical connections between the pins of the socket and the leads of the component. This is accomplished by pushing the component leads into the sockets and then providing a quick and secure lock. In this way, an extremely mother solder connection is made that resists vibrations, shock and thermal cycling. The patented design ensures minimal contact resistance and provides an extremely reliable connection.

The 20-71070-10socket is also designed to be very easy to use. The pins are clearly marked for easy identification, and installation is quick and nearly effortless. The sockets are also self-alignment for optimal performance, and can be easily reconfigured to accommodate components of various sizes and shapes. The sockets also have an extremely low insertion and removal force, reducing the risk of damage to components during installation and maintenance.

In conclusion, the 20-71070-10 application field and working principle is a highly effective and reliable method for connecting ICs, transistors and other electronic components. It can be used in a wide variety of applications, has a simple and efficient installation process, and is designed to provide strong and secure connections that resist vibrations and thermal cycling. Because of these advantages, it has become a popular choice among many electronic engineers.

The specific data is subject to PDF, and the above content is for reference

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