20-81250-310C Allicdata Electronics
Allicdata Part #:

20-81250-310C-ND

Manufacturer Part#:

20-81250-310C

Price: $ 6.92
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 20POS GOLD
More Detail: N/A
DataSheet: 20-81250-310C datasheet20-81250-310C Datasheet/PDF
Quantity: 1000
10 +: $ 6.29370
Stock 1000Can Ship Immediately
$ 6.92
Specifications
Series: 8
Packaging: Bulk 
Part Status: Active
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C
Termination Post Length: 0.140" (3.56mm)
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Contact Resistance: --
Description

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The 20-81250-310C socket is a device used in a wide variety of applications and has a variety of working principles. This socket is used to connect integrated circuits (ICs), transistors, and other electronic components to each other in a circuit or integrated circuit. It is designed to provide secure connections, ensure accurate contact between the ICs, and reduce the effects of thermal cycles.

The 20-81250-310C socket uses two contact points, one for each IC or transistor in the circuit. The contacts are usually on the same side of the socket. The contacts themselves are typically made of copper and are plated with gold. This provides a low-resistance, high-speed electrical connection between the two components. Typically, the 20-81250-310C socket is designed in such a way that it can easily be soldered or welded to the IC or transistor in order to ensure a secure connection.

The 20-81250-310C socket is primarily designed for use in high-volume, high-density circuits. It has been used widely in the manufacture of complex devices such as computers, cell phones, and digital cameras. It is also a common choice for industrial applications, where its robust design makes it ideal for harsh and extreme conditions.

The working principle of the 20-81250-310C socket is fairly straightforward. When an electrical current is applied to the two contact points, a connection is established between them. This connection allows electricity to flow between the two components. The gold plating on the contactpoints prevents corrosion and increases the quality of the connection.

The gold plating on the 20-81250-310C socket also provides a low-resistance connection. This means that electrons can move through the socket at a high speed, allowing high-speed communication between the two components. In addition, the gold plating serves to reduce the effects of thermal cycling, as the metal’s thermal conductivity is much higher than materials used in other connectors.

In addition to its use in high-volume, high-density applications, the 20-81250-310C socket is also used in medical and automotive applications. In these situations, it is also designed to provide a high level of security and accuracy. For example, it is often used in medical instruments to ensure a reliable and accurate connection between two machines.

The 20-81250-310C socket is a popular choice for a wide variety of applications. Its robust design and ability to provide secure connections make it an excellent choice for applications that require a reliable and accurate connection. Its gold plating also makes it an attractive choice for high-volume and highly demanding circuits. As such, it is an important tool for those looking for a reliable and secure connection.

The specific data is subject to PDF, and the above content is for reference

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