20-8500-310C

Series:	8
Packaging:	Bulk
Part Status:	Active
Type:	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):	20 (2 x 10)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame, Elevated
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Gold
Contact Finish Thickness - Post:	10.0µin (0.25µm)
Contact Material - Post:	Brass
Housing Material:	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:	-55°C ~ 105°C
Termination Post Length:	0.140" (3.56mm)
Material Flammability Rating:	UL94 V-0
Current Rating:	3A
Contact Resistance:	--

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<p>The 20-8500-310C socket is a versatile device designed for use in engineering applications. It offers a convenient way to integrate Application Specific Integrated Circuits (ASICs) into an application, and can also be used for ICs, transistors, and other technologies. This article will discuss the application field of the 20-8500-310C socket, as well as its basic working principle. </p><h3>Application Field</h3><p>The 20-8500-310C socket is used in a wide variety of engineering projects. It is used in the development of embedded systems, in automotive, medical, industrial, audio/video, retail, and defense applications. It can also be used to create custom ICs or transistors, or to integrate existing microcontrollers into an existing system.</p><p>The 20-8500-310C socket has a wide range of applications in industrial sealing, sealing of housing assemblies, protection from hostile environments, and vibration and shock control. Its robust construction makes it ideal for these types of applications, and it offers superior protection against dust, damp, and vibration.</p><p>The 20-8500-310C socket is also suitable for use in computer systems, to connect flash memory cards, CPU, system board, and other devices. As it is designed for high speed data transfers, it is an excellent choice for a wide range of industrial and commercial applications.</p> <h3>Working Principle</h3><p>The 20-8500-310C socket is designed to provide a reliable connection between chips and systems. Its unique design allows for fast and reliable communication and power transmission. Its multiple contacts create a solid contact that maximizes electrical and thermal performances, and it ensures the most efficient utilization of power.</p><p>The 20-8500-310C socket is designed with a patented ‘Dynamic Card - Floating Contact System’. This system ensures that all connections between the chip and the system are secure and stable, thereby preventing any potential failures or data loss. The dynamic system also allows for controlled insertion and extraction of the chip, reducing the risk of misalignment or contact failures.</p><p>The 20-8500-310C socket is also designed with an advanced mold design that improves heat dissipation. This helps to extend the life of the socket and ensures that temperatures remain within the safe operating range.</p> <p>The 20-8500-310C socket is an ideal choice for a wide range of applications, and its robust design makes it suitable for industrial, automotive, medical, and defense applications. Its advanced design and low-cost manufacturing process make it a cost-effective choice. Its versatile nature makes it a great choice for integrating custom or existing chips into an application.</p>

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