2040727-1 Connectors, Interconnects

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Memory Connectors - Inline Module Sockets provide efficient connectivity solutions for memory applications in electronics, telecommunications, automotive, medical and industrial markets. The 2040727-1 is an inline module socket designed to provide a robust and modular solution for connectivity needs. The socket is capable of integrating memory modules with electrical and mechanical components to offer a high degree of flexibility and reliability for a wide range of applications.

The 2040727-1 is designed for applications that require high reliability and durability. The socket is designed to enable direct interfacing between the memory module and other electronic components such as connectors, antennas, and circuit boards. The 2040727-1 also features a multi-pin alignment guide that prevents the misalignment of the module and the socket and ensures the secure electrical connection between the two components. The socket is also designed with a guide pin, which provides a precise alignment between the module and the socket. The guide pin also serves as a shock absorber reducing the mechanical stress on the socket.

The 2040727-1 is designed to meet the needs of a variety of memory applications. It features two types of contact surfaces, namely, the open-type pad and the closed-type pad. The open-type pad is designed for capacitive loads, while the closed-type pad is designed for applications that require lower current and signal loads. With the open-type pad design, the socket features an additional air gap between the module and the socket to increase the electrical performance. The closed-type pad is designed to provide a tight, sealed contact between the module and the socket.

The 2040727-1 socket also has a built-in latch feature. The latch mechanism is designed to provide an audible click that indicates when the module is securely inserted into the socket. The latch also has a pin-out feature that allows the use of modules in different orientation by providing access to the IO contacts of the module, making the socket more adaptable to different memory needs.

The 2040727-1 socket also utilizes a high-performance impedance controlled design. The impedance of the socket are controlled using a combination of ground vias and capacitance elements. This impedance control ensures that the electrical properties of the socket remain consistent throughout the current and signal operation ranges. The impedance control also maintains electrical stability by preventing unwanted noise and interference from entering the socket.

Furthermore, the 2040727-1 socket uses a two-piece construction that allows for passive shielding of the module, ensuring superior noise immunity and data integrity. The socket also has a power shield structure that can be configured for different operating modes, such as active, bypass, or inactive. This feature allows the system designer to tailor the socket to meet the specific needs of the application.

In conclusion, the 2040727-1 socket provides a reliable and versatile solution for memory application needs. Its two-piece construction with integrated power shielding, impedance control, and multi-pin alignment guide offers enhanced reliability and performance. The latch mechanism ensures secure connections and the pad design provides flexibility and allows for the use of different capabilities. Overall, the 2040727-1 socket is well suited for a wide range of memory applications.

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