210-13-320-41-001000 Allicdata Electronics
Allicdata Part #:

21013-32041001000-ND

Manufacturer Part#:

210-13-320-41-001000

Price: $ 9.09
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN IC DIP SOCKET 20POS GOLD
More Detail: N/A
DataSheet: 210-13-320-41-001000 datasheet210-13-320-41-001000 Datasheet/PDF
Quantity: 1000
60 +: $ 8.26280
Stock 1000Can Ship Immediately
$ 9.09
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: --
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 210
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors

210-13-320-41-001000 application field and working principle provides a great way to connect ICs, transistors, and other components for prototyping and building of different projects. With sockets for ICs and transistors, one can create a simple and easy connection between them which is also reliable and robust.

Types of Sockets

There are many types of sockets available for connecting ICs and transistors. These can be divided into two primary categories: single in-line sockets (SILs) and dual in-line sockets (DILs). Single in-line sockets usually have an even number of pins, while dual in-line sockets usually have an odd number of pins.

Single in-line sockets are suitable for connecting single ICs and transistors and are the most popular type of socket in use today. DIPs (dual in-line packages) are a larger and more complex socket type which can be used to connect multiple ICs and transistors together. The type of socket used will depend on the requirements of the project and the complexity of the design.

Working Principle of Sockets for ICs & Transistors

Sockets are made up of two layers of flexible material, separated by a gap. When an IC or transistor is inserted into the socket, the two layers squeeze together to form a secure connection. The two layers are usually made of ceramic, which provide good insulation and have excellent thermal properties. Sockets for ICs and transistors are designed to provide a reliable connection, and most sockets feature a locking mechanism to ensure the connections stays secure.

The socket also acts as a buffer between the IC and the circuit board, and helps protect the IC from any damage that may occur during the soldering process. Additionally, the socket allows for easy removal and replacement of ICs and transistors if necessary.

Advantages & Disadvantages of Using Sockets

The primary advantage of using sockets for ICs and transistors is that it provides a reliable connection, and helps protect the IC or transistor from any damage that could occur during the soldering process. It also allows for quick and easy removal and replacement of the IC or transistor, should the need arise.

One disadvantage of using sockets is that they add complexity to the design, which can increase the cost of the project. They also require more space on the circuit board, and can cause difficulty when troubleshooting as any faults may not be found in the socket.

Conclusion

Sockets for ICs and transistors provide a great way to connect ICs and transistors, as well as other components, for purposes of prototyping and building different projects. With their locking mechanisms and thermal means of insulation, sockets make a reliable and robust connection. However, they add to the complexity of such projects and can become costly, plus consume more space on the circuit board.

The specific data is subject to PDF, and the above content is for reference

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