| Allicdata Part #: | 21013-32041001000-ND |
| Manufacturer Part#: |
210-13-320-41-001000 |
| Price: | $ 9.09 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Mill-Max Manufacturing Corp. |
| Short Description: | CONN IC DIP SOCKET 20POS GOLD |
| More Detail: | N/A |
| DataSheet: | 210-13-320-41-001000 Datasheet/PDF |
| Quantity: | 1000 |
| 60 +: | $ 8.26280 |
| Termination: | Solder |
| Contact Resistance: | -- |
| Current Rating: | 3A |
| Material Flammability Rating: | -- |
| Termination Post Length: | 0.125" (3.18mm) |
| Operating Temperature: | -55°C ~ 125°C |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Contact Material - Post: | Brass Alloy |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Finish - Post: | Gold |
| Pitch - Post: | 0.100" (2.54mm) |
| Series: | 210 |
| Features: | Closed Frame |
| Mounting Type: | Through Hole |
| Contact Material - Mating: | Beryllium Copper |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Finish - Mating: | Gold |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Part Status: | Active |
| Packaging: | Tube |
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Sockets for ICs, Transistors
210-13-320-41-001000 application field and working principle provides a great way to connect ICs, transistors, and other components for prototyping and building of different projects. With sockets for ICs and transistors, one can create a simple and easy connection between them which is also reliable and robust.
Types of Sockets
There are many types of sockets available for connecting ICs and transistors. These can be divided into two primary categories: single in-line sockets (SILs) and dual in-line sockets (DILs). Single in-line sockets usually have an even number of pins, while dual in-line sockets usually have an odd number of pins.
Single in-line sockets are suitable for connecting single ICs and transistors and are the most popular type of socket in use today. DIPs (dual in-line packages) are a larger and more complex socket type which can be used to connect multiple ICs and transistors together. The type of socket used will depend on the requirements of the project and the complexity of the design.
Working Principle of Sockets for ICs & Transistors
Sockets are made up of two layers of flexible material, separated by a gap. When an IC or transistor is inserted into the socket, the two layers squeeze together to form a secure connection. The two layers are usually made of ceramic, which provide good insulation and have excellent thermal properties. Sockets for ICs and transistors are designed to provide a reliable connection, and most sockets feature a locking mechanism to ensure the connections stays secure.
The socket also acts as a buffer between the IC and the circuit board, and helps protect the IC from any damage that may occur during the soldering process. Additionally, the socket allows for easy removal and replacement of ICs and transistors if necessary.
Advantages & Disadvantages of Using Sockets
The primary advantage of using sockets for ICs and transistors is that it provides a reliable connection, and helps protect the IC or transistor from any damage that could occur during the soldering process. It also allows for quick and easy removal and replacement of the IC or transistor, should the need arise.
One disadvantage of using sockets is that they add complexity to the design, which can increase the cost of the project. They also require more space on the circuit board, and can cause difficulty when troubleshooting as any faults may not be found in the socket.
Conclusion
Sockets for ICs and transistors provide a great way to connect ICs and transistors, as well as other components, for purposes of prototyping and building different projects. With their locking mechanisms and thermal means of insulation, sockets make a reliable and robust connection. However, they add to the complexity of such projects and can become costly, plus consume more space on the circuit board.
The specific data is subject to PDF, and the above content is for reference
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210-13-320-41-001000 Datasheet/PDF