22-6503-20 Allicdata Electronics
Allicdata Part #:

22-6503-20-ND

Manufacturer Part#:

22-6503-20

Price: $ 5.96
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 22POS GOLD
More Detail: N/A
DataSheet: 22-6503-20 datasheet22-6503-20 Datasheet/PDF
Quantity: 1000
13 +: $ 5.42430
Stock 1000Can Ship Immediately
$ 5.96
Specifications
Termination: Wire Wrap
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.360" (9.14mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 503
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 22 (2 x 11)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 22-6503-20 is a type of sockets that is used for integrated circuits (ICs). It offers improved connectivity and convenience in the assembly of printed circuit boards (PCBs). This socket can accommodate a variety of ICs such as dual in-line package (DIP) and surface mounted (SMD) types. The 22-6503-20 has two rows, each having 20 double access, plated-through holes, which can accept a maximum of 40 pins. It also has two rows of integral-style mounting holes that can be used to secure the socket to a PCB.

The 22-6503-20 is a three terminal socket, which works with transistors. It has three connections, with one being the base connection, another the collector connection, and the last being the emitter connection. Each connection is intended for a particular purpose, so it is absolutely essential that the connections are not reversed. The base connection is used to control current through the transistor while the collector connection feeds power to the transistor. The emitter connection is then used to extract the power from the transistor. This type of socket enables an appropriate amount of current to power the transistor, allowing the circuit to function efficiently.

Plus, it can also be used as a temporary connection point for troubleshooting or as a permanent base for prototyping. With the 22-6503-20 socket, electronics technicians can replace defective transistors quickly and easily as it eliminates the need for soldering. With this socket, the connections are made in a matter of seconds and can be modified quickly and without much fuss.

The 22-6503-20 socket is made of high-grade thermoplastic with an insulating design that ensures superior stability and minimal thermal drift. Additionally, it has a heat dissipation characteristic that ensures effective heat transfer from the heated areas of the motherboard, making it an ideal choice for applications in harsh environments. Furthermore, the physical construction of the socket allows its contacts to be spaced closer together, providing a stable electrical connection.

The working principle of the 22-6503-20 socket is based on electrical contact pressure. It includes a mating spring that expands when current is applied, making the contact pressure between the contacts strong and uniform. This ensures a strong and reliable connection, keeping the socket firmly in place. Further, the contact pressure results in a greater number of operative cycles, thus increasing the life expectancy of the socket.

In conclusion, the 22-6503-20 socket offers a number of advantages when it comes to ICs, transistors, and also for prototyping. It is a robust and reliable device which ensures maximum contact pressure between the contacts and provides a stable electrical connection. Additionally, it offers dimensional stability and improved thermal performance, making it suitable for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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